Effect of Bi and Ce co-doping in garnet-based materials: Impact on microwave device performance

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jyoti Saini , Monika Sharma , Sheetal Yadav , Bijoy Kumar Kuanr
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引用次数: 0

Abstract

Microwave devices in the modern era are rapidly integrating new substrates for passive devices such as filters, phase shifters, isolators, and circulators, etc. Garnet ferrites doped with rare-earth elements have emerged as promising candidates for reciprocal and nonreciprocal microwave devices using direction-dependent information transfer. This study demonstrates how Bi and Ce co-doping in yttrium iron garnet enhances microwave device functionality, including operating frequency, phase shift, and isolation. A flip-chip-based FMR configuration with a S-type microstrip line enabled a reciprocal notch filter design with 100 % tunability for 0.4 cerium concentration. The linewidth of the device was observed to be cerium concentration-dependent with a maximum for 0.6. A maximum differential phase shift of approximately 114°/cm was achieved for the Ce = 0.2 sample at an external magnetic field of 6.6 kOe. A straight microstrip line in parallel configuration facilitated nonreciprocal wave propagation in the Bi and Ce co-doped YIG. The nonreciprocal isolation was significantly enhanced with the applied DC bias magnetic field. Experimental results were validated using HFSS simulations, confirming the potential use of substrates made from Bi and Ce co-doped yttrium iron garnet for the fabrication of reciprocal and non-reciprocal microwave devices.
石榴石基材料中Bi和Ce共掺杂对微波器件性能的影响
现代微波器件正在迅速集成新的无源器件基板,如滤波器、移相器、隔离器和环行器等。稀土元素掺杂的石榴石铁氧体已成为利用方向相关信息传输的互反和非互反微波器件的有希望的候选者。本研究展示了Bi和Ce在钇铁石榴石中的共掺杂如何增强微波器件的功能,包括工作频率、相移和隔离。基于倒装芯片的FMR配置和s型微带线实现了对0.4铈浓度具有100%可调性的倒易陷波滤波器设计。观察到该器件的线宽与铈浓度有关,其最大值为0.6。在6.6 kOe的外磁场下,Ce = 0.2样品的最大差相移约为114°/cm。平行结构的直微带线促进了Bi和Ce共掺YIG中非互反波的传播。外加直流偏置磁场显著增强了非互反隔离。利用HFSS模拟验证了实验结果,证实了由Bi和Ce共掺杂钇铁石榴石制成的衬底用于制造互反和非互反微波器件的潜在用途。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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