Thermal management of automotive radar: Overcoming design challenges in constrained environments

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-04-01 DOI:10.1016/j.microrel.2025.115725

Myong Hun Oh , Su Hyun Yoon , Soo Il Jeon , Minsuk Choi

{"title":"Thermal management of automotive radar: Overcoming design challenges in constrained environments","authors":"Myong Hun Oh , Su Hyun Yoon , Soo Il Jeon , Minsuk Choi","doi":"10.1016/j.microrel.2025.115725","DOIUrl":null,"url":null,"abstract":"<div><div>Effective thermal management of automotive radar sensors operating under natural convection is essential for their optimal performance and reliability. This study introduces a comprehensive thermal design methodology for an automotive radar sensor using both experimental measurements and numerical simulations. Major heat-generating components in the radar sensor were firstly identified, and their temperatures were measured to determine the heat generation rates. Numerical simulations were then conducted to model the sensor's thermal behavior with and without its enclosure, focusing on natural convection as the primary cooling mechanism. Various thermal design strategies, including thermal bridges, were tested to improve the sensor's cooling. Experimental results demonstrated that the proposed methodology could increase the duty cycle of the radar sensor by approximately 6 % at room temperature and 8 % at high temperatures. This research highlights the effectiveness of the proposed thermal design methodology in addressing thermal management challenges, thereby improving the performance and reliability of automotive radar sensors in confined spaces.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"168 ","pages":"Article 115725"},"PeriodicalIF":1.6000,"publicationDate":"2025-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425001386","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

Effective thermal management of automotive radar sensors operating under natural convection is essential for their optimal performance and reliability. This study introduces a comprehensive thermal design methodology for an automotive radar sensor using both experimental measurements and numerical simulations. Major heat-generating components in the radar sensor were firstly identified, and their temperatures were measured to determine the heat generation rates. Numerical simulations were then conducted to model the sensor's thermal behavior with and without its enclosure, focusing on natural convection as the primary cooling mechanism. Various thermal design strategies, including thermal bridges, were tested to improve the sensor's cooling. Experimental results demonstrated that the proposed methodology could increase the duty cycle of the radar sensor by approximately 6 % at room temperature and 8 % at high temperatures. This research highlights the effectiveness of the proposed thermal design methodology in addressing thermal management challenges, thereby improving the performance and reliability of automotive radar sensors in confined spaces.

查看原文本刊更多论文

求助全文

约1分钟内获得全文求助全文

来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.