F. Velardi , G. Canale Parola , S. Palazzo , E. Martano , A. Sanseverino , L. Silvestrin , C. Abbate , G. Busatto
{"title":"The behaviour of 350 V GaN HEMTs during heavy ion irradiations","authors":"F. Velardi , G. Canale Parola , S. Palazzo , E. Martano , A. Sanseverino , L. Silvestrin , C. Abbate , G. Busatto","doi":"10.1016/j.microrel.2025.115723","DOIUrl":null,"url":null,"abstract":"<div><div>The behaviour of a 350 V Enhancement Mode GaN power HEMT during heavy ion irradiation is presented. A new experimental setup has been developed to increase the sensitivity of the measurement. It allowed the measurement of the charge collected at the terminals following the impact with energetic particles to be extended by almost an order of magnitude. The results obtained, interpreted with the help of two-dimensional finite element simulations, demonstrate that the tested devices exhibit very different behaviour from those previously characterized. They do not show significant charge amplification and are not subjected to single-event gate rupture. Furthermore, it is demonstrated that the device failure is due to a recursive mechanism like that which develops in silicon PiN diodes when exposed to heavy ion irradiation.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"168 ","pages":"Article 115723"},"PeriodicalIF":1.6000,"publicationDate":"2025-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425001362","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The behaviour of a 350 V Enhancement Mode GaN power HEMT during heavy ion irradiation is presented. A new experimental setup has been developed to increase the sensitivity of the measurement. It allowed the measurement of the charge collected at the terminals following the impact with energetic particles to be extended by almost an order of magnitude. The results obtained, interpreted with the help of two-dimensional finite element simulations, demonstrate that the tested devices exhibit very different behaviour from those previously characterized. They do not show significant charge amplification and are not subjected to single-event gate rupture. Furthermore, it is demonstrated that the device failure is due to a recursive mechanism like that which develops in silicon PiN diodes when exposed to heavy ion irradiation.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.