The optoelectronic properties in two-dimensional sliding ferroelectric material XC (X = Ge, Si) under strain

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Qian Zou , Jieru Sun , Yongxin Cui, Junhao Ma, Hong-an Lu, Yi Wu, Chonggui Zhong, Huailiang Fu, Lei Zhang, Pengxia Zhou
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引用次数: 0

Abstract

Two-dimensional sliding ferroelectricity has attracted significant attention owing to its unique reversible out-of-plane polarization generated by interlayer sliding. Numerous materials have been experimentally verified to demonstrate this phenomenon. In this work, bilayer honeycomb XC (X = Ge, Si) is investigated using the first-principles calculations to explore the ground state structure, electronic, transport and optical properties. First, the most stable AB configuration is identified, and its electronic structure is studied and modulated via strain engineering. Results indicate that the band gap gradually decreases as the strain transitions from compressive to tensile. Furthermore, the carrier mobility and optical absorption of AB-stacked XC (X = Ge, Si) are researched, revealing exceptionally high mobility that can be effectively tuned within the strain range of −8 %–8 %. Additionally, the optical absorption coefficient of the system presents the phenomenon of red-shift in sequence from compressive to tensile strain. These findings provide valuable insights into the photovoltaic potential of sliding ferroelectrics, suggesting promising applications in photovoltaics, solar cells, and optoelectronic devices.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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