Ruiliang Zhou , Jian Yang , Hailong Liu , Chen Xu , Yan Pu , Ivan S. Babichuk
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引用次数: 0
Abstract
Two-dimensional (2D) materials, particularly transition metal dichalcogenides (TMDs), have shown great potential in optoelectronics and energy storage due to their unique properties. However, defects such as impurities and voids can significantly impact their electronic, optical, and magnetic characteristics. Traditional defect detection methods, such as scanning transmission electron microscopy (STEM), are time-consuming and limited in scalability. This study introduces DeepMGD, a novel deep learning model designed for efficient and accurate defect detection in molybdenum disulfide (MoS) films fabricated via chemical vapor deposition (CVD) and imaged using optical microscopy. DeepMGD utilizes MobileNetV4 as its backbone, Gold-YOLO as the neck, and a decoupled head. The architecture attains a competitive mAP@50 of 0.894 under challenging illumination conditions while maintaining a lean parameter count of 5.129 million, achieving 122.2 FPS on a GPU and 3.0 FPS on a CPU. Additionally, we present the DeepMGD Agent, an intelligent system framework that integrates the DeepMGD model with a large language model (LLM) and a Python interpreter. This framework automates defect detection and analysis, offering an intuitive workflow for users. The system processes microscopic images and user commands to detect defects and generate natural language explanations, enabling seamless defect detection and quantitative analysis. This work provides a reliable and efficient approach for analyzing 2D materials, with potential applications for other similar materials in the future. The code is released at https://github.com/zhouruiliangxian/DeepMGD.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.