{"title":"Development of Fully ZnO-Based 16 × 16 1S1R RRAM Crossbar Array and Performance Investigations","authors":"Ting-Jui Wang;Cheng-Ying Li;Po-An Shih;Jai-Hao Wang;Kuan-Lin Yeh;Kai-Ling Hsu;Sheng-Yuan Chu","doi":"10.1109/TED.2025.3539650","DOIUrl":null,"url":null,"abstract":"This study investigates the effects of co-sputtering SiC into zinc oxide (ZnO):Li (3 mol%) thin films, resulting in the formation of lithium-doped zinc oxide: silicon carbide (LZO:SiC) oxide layers. These oxide layers have different work functions (WFs) due to their distinct chemical bonding. Subsequently, these layers are stacked together to form a form-free one-selector and one-resistor (1S1R) structure. This structure comprises Pt/V/LZO:SiC2 (buffer layer)/LZO:SiC1 (oxide layer)/TiN. Notably, this marks the first successful production of a ZnO-based 1S1R structure using this method. In our experiments, we observed that this novel structure significantly enhances I–V nonlinearity, increasing it from the initial value of 2.14–62. Furthermore, according to our calculations, the optimal array size has substantially increased from the original 4 bits to over 2500 bits, indicating the enormous potential of this technology for high-density memory applications. Building on these results, we further utilized photomask manufacturing technology to successfully create a <inline-formula> <tex-math>$16\\times 16~1$ </tex-math></inline-formula>S1R resistive random access memory (RRAM) crossbar array. To the best of our knowledge, this is the first report of applying a ZnO-based 1S1R structure to a crossbar array. This study not only demonstrates the feasibility of ZnO-based 1S1R structures but also opens new directions for future applications in high-performance memory technologies. Our findings showcase the potential advantages of this technology and provide a solid foundation for further technological development and practical applications.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 4","pages":"1702-1708"},"PeriodicalIF":2.9000,"publicationDate":"2025-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10945881/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This study investigates the effects of co-sputtering SiC into zinc oxide (ZnO):Li (3 mol%) thin films, resulting in the formation of lithium-doped zinc oxide: silicon carbide (LZO:SiC) oxide layers. These oxide layers have different work functions (WFs) due to their distinct chemical bonding. Subsequently, these layers are stacked together to form a form-free one-selector and one-resistor (1S1R) structure. This structure comprises Pt/V/LZO:SiC2 (buffer layer)/LZO:SiC1 (oxide layer)/TiN. Notably, this marks the first successful production of a ZnO-based 1S1R structure using this method. In our experiments, we observed that this novel structure significantly enhances I–V nonlinearity, increasing it from the initial value of 2.14–62. Furthermore, according to our calculations, the optimal array size has substantially increased from the original 4 bits to over 2500 bits, indicating the enormous potential of this technology for high-density memory applications. Building on these results, we further utilized photomask manufacturing technology to successfully create a $16\times 16~1$ S1R resistive random access memory (RRAM) crossbar array. To the best of our knowledge, this is the first report of applying a ZnO-based 1S1R structure to a crossbar array. This study not only demonstrates the feasibility of ZnO-based 1S1R structures but also opens new directions for future applications in high-performance memory technologies. Our findings showcase the potential advantages of this technology and provide a solid foundation for further technological development and practical applications.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.