Shruti Pathak;Deepesh Sharma;P. Srinivasan;Oscar H. Gonzalez;Abhisek Dixit
{"title":"Flicker Noise Behavior in Advanced Bulk FinFETs at Cryogenic Temperatures","authors":"Shruti Pathak;Deepesh Sharma;P. Srinivasan;Oscar H. Gonzalez;Abhisek Dixit","doi":"10.1109/TED.2025.3544996","DOIUrl":null,"url":null,"abstract":"This work investigates the flicker (<inline-formula> <tex-math>${1}/{f}$ </tex-math></inline-formula>) noise in bulk 12-nm regular threshold voltage (RVT) and super-low threshold voltage (SLVT) n- and p-FinFETs from 300 K down to the cryogenic temperatures range (up to 10 K). The dominant source of noise is carrier number fluctuation for the entire temperature range for both n- and p-FinFETs. The normalized noise is demonstrated to be independent of temperature at several gate overdrive voltages. A detailed comparison of RVT and SLVT devices is presented based on their flicker noise performance, which shows a weak-to-no significant increase in normalized noise in RVT and SLVT FinFETs at 10 and 300 K. The frequency exponent (<inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>) has been examined, showing a uniform trap distribution and weak temperature dependence. The trapping time constant (<inline-formula> <tex-math>$\\tau _{\\text {T}}$ </tex-math></inline-formula>) is analyzed and found to be temperature-independent, possibly due to the temperature-dependent behavior of the tunneling time constant (<inline-formula> <tex-math>$\\tau _{\\text {o}}$ </tex-math></inline-formula>), leading to the minimal temperature dependence of <inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>. Moreover, active volume trap density (<inline-formula> <tex-math>${N}_{\\text {T}}$ </tex-math></inline-formula>) causing flicker noise is studied with temperature using the carrier number fluctuation model, which is illustrated to be nearly constant by combining the impact of tunneling parameter (<inline-formula> <tex-math>$\\gamma $ </tex-math></inline-formula>) and thermal energy with temperature.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 4","pages":"1926-1932"},"PeriodicalIF":2.9000,"publicationDate":"2025-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10909598/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This work investigates the flicker (${1}/{f}$ ) noise in bulk 12-nm regular threshold voltage (RVT) and super-low threshold voltage (SLVT) n- and p-FinFETs from 300 K down to the cryogenic temperatures range (up to 10 K). The dominant source of noise is carrier number fluctuation for the entire temperature range for both n- and p-FinFETs. The normalized noise is demonstrated to be independent of temperature at several gate overdrive voltages. A detailed comparison of RVT and SLVT devices is presented based on their flicker noise performance, which shows a weak-to-no significant increase in normalized noise in RVT and SLVT FinFETs at 10 and 300 K. The frequency exponent ($\beta $ ) has been examined, showing a uniform trap distribution and weak temperature dependence. The trapping time constant ($\tau _{\text {T}}$ ) is analyzed and found to be temperature-independent, possibly due to the temperature-dependent behavior of the tunneling time constant ($\tau _{\text {o}}$ ), leading to the minimal temperature dependence of $\beta $ . Moreover, active volume trap density (${N}_{\text {T}}$ ) causing flicker noise is studied with temperature using the carrier number fluctuation model, which is illustrated to be nearly constant by combining the impact of tunneling parameter ($\gamma $ ) and thermal energy with temperature.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.