Multiwindow Implantation Method in Vertical Hall Devices for High Sensitivity

IF 2.9 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Electron Devices Pub Date : 2025-03-11 DOI:10.1109/TED.2025.3546187

Guiqiang Zheng;Nannan Cheng;Yichen Li;Jiawei Dou;Qingyin Zhong;Jie Ma;Lanlan Yang;Xiaofeng Sun;Dejin Wang;Sen Zhang;Yongjia Li;Long Zhang;Siyang Liu;Weifeng Sun

引用次数: 0

Abstract

A novel vertical Hall device (VHD), featuring a waved boundary magnetic-sensitive well, is proposed for the first time in this article. By applying multiwindow implantation (MWI) method in 0.15-

$\mu $

m bipolar-CMOS–DMOS (BCD) platform, nonuniform doping profile in lateral and vertical directions is realized and the path of bias current is changed subsequently. The current path with long route and low resistance in the proposed VHD increases the ratio of longitudinal current and a current related sensitivity (

${S} _{I}$

) of 178 V/AT is achieved, which is 49.6% improved compared with the standard VHD. The proposed VHD provides a new solution for the design of high-sensitivity Hall device.

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垂直霍尔器件的高灵敏度多窗口植入方法

本文首次提出了一种具有波边界磁敏井的新型垂直霍尔装置（VHD）。在0.15- $\mu $ m双极cmos - dmos （BCD）平台上应用多窗口注入（MWI）方法，实现了横向和纵向上的非均匀掺杂，改变了偏置电流的路径。该VHD采用了长路径、低电阻的电流路径，提高了纵向电流比，实现了178 V/AT的电流相关灵敏度（${S} _{I}$），比标准VHD提高了49.6%。该方法为高灵敏度霍尔器件的设计提供了一种新的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Electron Devices 工程技术-工程：电子与电气

CiteScore

5.80

自引率

16.10%

发文量

937

审稿时长

3.8 months

期刊介绍： IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.