Research on the degradation of contact resistance of wire-spring contacts in different wear condition

IF 1.9 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-03-31 DOI:10.1016/j.microrel.2025.115721

Le Xu , Yuyao Zhao , Shujuan Wang , Ji Jiang

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引用次数: 0

Abstract

Electrical connectors are important components in electrical systems, responsible for the transmission and control of electrical signals. In the process of use, frictional wear occurs between the pins and sockets of the contactor in an electrical connector. This phenomenon results in an increase in contact resistance, which can further lead to system failures, so it is critical to ensure the stability of the performance of the contactor. In this paper, a commonly used specification of wire-spring contacts is investigated. Firstly, the mechanical properties of the component were analyzed. Subsequently, the contact component underwent vibration testing under various conditions at room temperature to identify the wear patterns associated with different vibration scenarios. Finally, using the experimental data, a physical model of frictional wear failure was developed for the contact component, enabling the determination of contact failure time as a function of vibration amplitude and frequency.

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不同磨损条件下线簧接触电阻退化的研究

电连接器是电气系统中的重要部件，负责电信号的传输和控制。在使用过程中，电连接器中接触器的引脚与插座之间会发生摩擦磨损。这种现象导致接触电阻增加，进而导致系统故障，因此确保接触器性能的稳定性至关重要。本文研究了一种常用的线弹簧触点规格。首先，对构件的力学性能进行了分析。随后，在室温下对接触部件进行了各种条件下的振动测试，以确定不同振动场景下的磨损模式。最后，利用实验数据，建立了接触部件摩擦磨损失效的物理模型，从而确定了接触失效时间作为振动幅值和频率的函数。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.