Investigation of the long-term dynamic RDS(on) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress conditions

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Fawad Rauf , Muhammad Farhan Tayyab , Samir Mouhoubi , Marcelo Lobo Heldwein , Gilberto Curatola
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Abstract

The Dynamic High Temperature Operating Life (DHTOL) test, outlined in JEDEC standard JEP180.01, validates the long-term switching reliability of Gallium Nitride (GaN) High Electron Mobility Transistors (HEMTs) for power management applications. Despite the standardized testing framework, variability in switching test conditions across manufacturers necessitates a thorough investigation of GaN HEMT's long-term switching reliability within specific applications. This study adopts a holistic approach encompassing technological considerations and application demands to assess the long-term switching reliability of p-GaN HEMTs. The analysis emphasizes monitoring the degradation of the dynamic on-state resistance (dRDS(on)). A structured methodology is employed to precisely model and validate current and voltage peaks via parasitic extraction, defining switching stress conditions. Junction temperature is estimated through FEM simulation of the package model, followed by long-term testing to evaluate degradation. In addition to the hard-switching stress tests with variable voltages, peak current, slew rates, and duty cycles, stress tests with switching loss-free conditions at different temperatures are also performed to assess the primary degradation mechanism. The comparison of long-term hard-switching stress tests and tests conducted under switching loss-free conditions highlights the hot electron effect as the primary contributor to long-term degradation during the hard-switching operation. The substantial influence of voltage and current overlap on degradation is validated by testing Schottky gate p-GaN HEMT with different slew rates. Furthermore, ohmic gate p-GaN HEMT is found to be relatively robust compared to Schottky gate-p-GaN HEMT under similar long-term hard-switching stress conditions.
对比应力条件下肖特基栅和欧姆栅GaN HEMT的长期动态RDS(on)变化及动态高温工作寿命测试稳健性研究
JEDEC标准JEP180.01中概述的动态高温工作寿命(DHTOL)测试验证了用于电源管理应用的氮化镓(GaN)高电子迁移率晶体管(hemt)的长期开关可靠性。尽管有标准化的测试框架,但制造商之间开关测试条件的可变性需要对GaN HEMT在特定应用中的长期开关可靠性进行彻底的调查。本研究采用了一种全面的方法,包括技术考虑和应用需求,以评估p-GaN hemt的长期开关可靠性。分析强调监测动态导通电阻(dRDS(on))的退化。采用结构化的方法,通过寄生提取精确建模和验证电流和电压峰值,定义开关应力条件。通过对封装模型的有限元模拟来估计结温,然后进行长期测试来评估退化情况。除了可变电压、峰值电流、转换率和占空比的硬开关应力测试外,还进行了不同温度下开关无损耗条件下的应力测试,以评估主要退化机制。通过对长期硬开关应力测试和无开关损耗条件下进行的测试进行比较,可以看出热电子效应是导致硬开关长期性能退化的主要原因。通过测试不同转换速率的肖特基栅p-GaN HEMT,验证了电压和电流重叠对降解的实质性影响。此外,在类似的长期硬开关应力条件下,与肖特基门p-GaN HEMT相比,欧姆门p-GaN HEMT相对稳健。
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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