Enhanced Capacitive Memory Window by Improving Remnant Polarization in Ferroelectric Capacitors for Non-Destructive Read

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Shankha Mukherjee;Jasper Bizindavyi;Mihaela I. Popovici;Sergiu Clima;Yang Xiang;Gourab De;Attilio Belmonte;Gouri Sankar Kar;Francky Catthoor;Shimeng Yu;Valeri V. Afanas’Ev;Jan Van Houdt
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引用次数: 0

Abstract

The unique concept of a non-volatile capacitive memory window (CMW) in ferroelectric (FE) capacitors (FeCAP) allows for a non-destructive read operation (NDRO). NDRO decouples the read- from the write-endurance which is ideal for random access memory and compute-in-memory applications. However, the optimal strategy to further improve the CMW remains uncertain. In this work, we first identify potential pathways to improve the CMW by studying the dependence of the relative dielectric permittivity ( $\epsilon _{\text {r}}$ ) of a FE on the remnant polarization ( ${P}_{\text {R}}$ ) and coercive field ( ${E} _{\text {C}}$ ). Results show that a FE stack having a higher ${P}_{\text {R}}$ and/or a lower ${E}_{\text {C}}$ leads to an improved $\epsilon _{\text {r}}$ and CMW for a given read-bias. Next, we experimentally demonstrate this and show that a trilayer FeCAP with an enhanced $2{P}_{\text {R}}$ achieves a high CMW $_{\epsilon }$ of ~20, which is ~1.5x higher than earlier best. Finally, we demonstrate a pulse-based NDRO confirming a robust 1.5x enhancement in CMW even after $10^{{11}}$ NDRO cycles.
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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