{"title":"Vertical GaN-on-Tungsten High Voltage pn-Diodes From Sapphire-Grown GaN Membranes","authors":"E. Brusaterra;E. Bahat Treidel;L. Deriks;S. Danylyuk;E. Brandl;J. Bravin;M. Pawlak;A. Külberg;M. Schiersch;A. Thies;O. Hilt","doi":"10.1109/LED.2025.3540156","DOIUrl":null,"url":null,"abstract":"In this work, we demonstrate vertical GaN pn-diodes for high voltage applications initially grown and processed on 4” sapphire substrates and then transferred to 4” tungsten substrates to achieve a fully vertical conduction path. Laser lift-off was used to separate the GaN-membrane device structures from the initial sapphire substrate. The diodes show improved forward conduction after the transfer process with on-state resistance reduced from <inline-formula> <tex-math>$1.52~\\pm ~0.05$ </tex-math></inline-formula> m<inline-formula> <tex-math>$\\Omega \\cdot $ </tex-math></inline-formula>cm2 to <inline-formula> <tex-math>$1.15~\\pm ~0.05$ </tex-math></inline-formula> m<inline-formula> <tex-math>$\\Omega \\cdot $ </tex-math></inline-formula>cm2 and the blocking strength is not heavily compromised with its mean value reduced from <inline-formula> <tex-math>$1015~\\pm ~47$ </tex-math></inline-formula> V to <inline-formula> <tex-math>$988~\\pm ~57$ </tex-math></inline-formula> V. High device yields of the membrane transfer procedure underscores this cost-competitive vertical GaN device technology for high-power applications without the need of expensive GaN substrates.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"46 4","pages":"564-567"},"PeriodicalIF":4.1000,"publicationDate":"2025-02-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10879079/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, we demonstrate vertical GaN pn-diodes for high voltage applications initially grown and processed on 4” sapphire substrates and then transferred to 4” tungsten substrates to achieve a fully vertical conduction path. Laser lift-off was used to separate the GaN-membrane device structures from the initial sapphire substrate. The diodes show improved forward conduction after the transfer process with on-state resistance reduced from $1.52~\pm ~0.05$ m$\Omega \cdot $ cm2 to $1.15~\pm ~0.05$ m$\Omega \cdot $ cm2 and the blocking strength is not heavily compromised with its mean value reduced from $1015~\pm ~47$ V to $988~\pm ~57$ V. High device yields of the membrane transfer procedure underscores this cost-competitive vertical GaN device technology for high-power applications without the need of expensive GaN substrates.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.