Interface trap density in ITO/Si Schottky junction photodetectors

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yaming Li , Dianbo Liu , Ruixi Liu , Yunxiao Cui , Yunfei Liu , Ziyi Ma , Yuewen Liu , Jiaxuan Wang , Ziqian Li , Yusen Dong , Jiaxin Li , Chenxi Du , Guihua Liao , Chong Li
{"title":"Interface trap density in ITO/Si Schottky junction photodetectors","authors":"Yaming Li ,&nbsp;Dianbo Liu ,&nbsp;Ruixi Liu ,&nbsp;Yunxiao Cui ,&nbsp;Yunfei Liu ,&nbsp;Ziyi Ma ,&nbsp;Yuewen Liu ,&nbsp;Jiaxuan Wang ,&nbsp;Ziqian Li ,&nbsp;Yusen Dong ,&nbsp;Jiaxin Li ,&nbsp;Chenxi Du ,&nbsp;Guihua Liao ,&nbsp;Chong Li","doi":"10.1016/j.mssp.2025.109482","DOIUrl":null,"url":null,"abstract":"<div><div>Interface trapping is a notorious effect that is known to limit the performance of Schottky junction photodetectors. In this paper, the interface traps and mobility mechanism of silicon Schottky junction photodetectors were studied with two different electrode structures, namely, field and Schottky structures. The dark current of the devices mainly originated from the junction area-dependent dark current. The characteristic tunneling energies of the devices with field and Schottky structures were 0.095 and 0.102eV, respectively, and their activation energies were 0.193 and 0.294eV, respectively, which are less than half the band gap of silicon. These values are consistent with the devices displaying a trap-assisted tunneling (TAT) mechanism. An equivalent circuit model of metal–insulator–semiconductor interface traps was constructed. The interface trap densities of the devices with field and Schottky structures were calculated to be 1.37 × 10<sup>10</sup> and 3.96 × 10<sup>11</sup>/(cm<sup>2</sup>∙eV), respectively. Thus, the field structure can effectively suppress the current arising from trap-assisted tunneling.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"193 ","pages":"Article 109482"},"PeriodicalIF":4.2000,"publicationDate":"2025-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125002197","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

Interface trapping is a notorious effect that is known to limit the performance of Schottky junction photodetectors. In this paper, the interface traps and mobility mechanism of silicon Schottky junction photodetectors were studied with two different electrode structures, namely, field and Schottky structures. The dark current of the devices mainly originated from the junction area-dependent dark current. The characteristic tunneling energies of the devices with field and Schottky structures were 0.095 and 0.102eV, respectively, and their activation energies were 0.193 and 0.294eV, respectively, which are less than half the band gap of silicon. These values are consistent with the devices displaying a trap-assisted tunneling (TAT) mechanism. An equivalent circuit model of metal–insulator–semiconductor interface traps was constructed. The interface trap densities of the devices with field and Schottky structures were calculated to be 1.37 × 1010 and 3.96 × 1011/(cm2∙eV), respectively. Thus, the field structure can effectively suppress the current arising from trap-assisted tunneling.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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