{"title":"Enhancing Thermoelectric Performance of Cd₃P₂ by Alloying with Dirac Material Cd₃As₂","authors":"Kunling Peng, Chenjian Fu, Yunzhen Du, Sikang Zheng, Meng Tian, Pengfei Gao, Jianjun Ying, Wenbin Yi, Xu Lu, Sheng Zhang, Guoyu Wang, Xiaoyuan Zhou","doi":"10.1002/aelm.202500034","DOIUrl":null,"url":null,"abstract":"This study systematically explores the electrical and thermal properties of Cd₃P₂ by alloying it with the Dirac material Cd₃As₂, employing a combined experimental and theoretical approach. The findings demonstrate three distinct characteristics of this solid solution system: i) The continuous solid solution formation between Cd₃P₂ and Cd₃As₂ enables the tuning of the band structure. ii) Increasing As content leads to a reduction in effective mass, decreased deformation potential, and a substantial enhancement in carrier mobility. iii) The system exhibits phosphorus vacancy generation, which creates donor levels within the band gap and consequently impacts thermoelectric performance. Specifically, an ultrahigh mobility exceeding 7 × 10<sup>3</sup> cm<sup>2</sup> V<sup>−1</sup> s<sup>−1</sup> is achieved in Cd₃PAs. This substantial improvement in mobility across the entire temperature range resulted in a twofold increase in the power factor and a marked enhancement in thermoelectric performance, particularly in the low-temperature region. These results provide foundational insights into the thermoelectric behavior governed by the interplay between the semiconductor Cd₃P₂ and the Dirac material Cd₃As₂, establishing a framework for further research and performance optimization of this solid solution system.","PeriodicalId":110,"journal":{"name":"Advanced Electronic Materials","volume":"152 1","pages":""},"PeriodicalIF":5.3000,"publicationDate":"2025-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Electronic Materials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1002/aelm.202500034","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
This study systematically explores the electrical and thermal properties of Cd₃P₂ by alloying it with the Dirac material Cd₃As₂, employing a combined experimental and theoretical approach. The findings demonstrate three distinct characteristics of this solid solution system: i) The continuous solid solution formation between Cd₃P₂ and Cd₃As₂ enables the tuning of the band structure. ii) Increasing As content leads to a reduction in effective mass, decreased deformation potential, and a substantial enhancement in carrier mobility. iii) The system exhibits phosphorus vacancy generation, which creates donor levels within the band gap and consequently impacts thermoelectric performance. Specifically, an ultrahigh mobility exceeding 7 × 103 cm2 V−1 s−1 is achieved in Cd₃PAs. This substantial improvement in mobility across the entire temperature range resulted in a twofold increase in the power factor and a marked enhancement in thermoelectric performance, particularly in the low-temperature region. These results provide foundational insights into the thermoelectric behavior governed by the interplay between the semiconductor Cd₃P₂ and the Dirac material Cd₃As₂, establishing a framework for further research and performance optimization of this solid solution system.
期刊介绍:
Advanced Electronic Materials is an interdisciplinary forum for peer-reviewed, high-quality, high-impact research in the fields of materials science, physics, and engineering of electronic and magnetic materials. It includes research on physics and physical properties of electronic and magnetic materials, spintronics, electronics, device physics and engineering, micro- and nano-electromechanical systems, and organic electronics, in addition to fundamental research.