A high-temperature nanostructured Cu-Ta-Li alloy with complexion-stabilized precipitates

IF 44.7 1区综合性期刊 Q1 MULTIDISCIPLINARY SCIENCES

Science Pub Date : 2025-03-27 DOI:10.1126/science.adr0299

B. C. Hornbuckle, J. A. Smeltzer, S. Sharma, S. Nagar, C. J. Marvel, P. R. Cantwell, M. P. Harmer, K. Solanki, K. A. Darling

引用次数: 0

Abstract

We present a bulk nanocrystalline copper alloy that can operate at near-melting temperatures with minimal coarsening and creep deformation. The thermal stability of the Cu-3Ta-0.5Li atomic % (at %) alloy is attributed to coherent, ordered L1₂ Cu₃Li precipitates surrounded by a tantalum-rich atomic bilayer phase boundary complexion. Adding 0.5 at % lithium to the immiscible Cu-Ta system changes the morphology of the nanoscale precipitates from spherical to cuboidal while simultaneously tailoring the phase boundary. The resultant complexion-stabilized nanoscale precipitates provide excellent thermal stability, strength, and creep resistance. The underlying alloy design principles may guide the development of next-generation copper alloys for high-temperature applications such as heat exchangers.

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我们展示了一种可在接近熔融温度下工作且粗化和蠕变变形极小的块状纳米结晶铜合金。Cu-3Ta-0.5Li 原子% (at %) 合金的热稳定性归功于富含钽的原子双层相界复合体所包围的连贯、有序的 L1 2 Cu 3 Li 沉淀。在不相溶的铜-钽体系中加入 0.5 at % 的锂后，纳米级沉淀物的形态从球形变为立方体，同时相界也发生了变化。由此产生的络合稳定的纳米级沉淀具有出色的热稳定性、强度和抗蠕变性。合金的基本设计原理可指导下一代铜合金的开发，用于热交换器等高温应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Science 综合性期刊-综合性期刊

CiteScore

61.10

自引率

0.90%

发文量

审稿时长

2.1 months

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