The New Method to Focus Multiple Sheet Electron Beam by Periodic Cusped Magnets With Multi-Zeros-Point Bias Magnetic Field

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Pengcheng Yin;Jinchi Cai;Jin Xu;Jian Zhang;Lingna Yue;Hairong Yin;Yong Xu;Guoqing Zhao;Wenxiang Wang;Yanyu Wei
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引用次数: 0

Abstract

The lack of a compact magnetic focusing system hurdles fulfilling the prominent potential of traveling wave tubes (TWTs) launched with multiple sheet electron beams (SEBs). To overcome this dilemma, this letter proposed an intriguing general method to confine multiple SEBs, which adopts novel horizontally extended periodic cusped magnets (PCM) with a multi-zero-point bias magnetic field. A new configuration with bespoke iron notches for multiple SEBs (Open PCM-NMSB) is employed to produce this unique field profile. To verify this concept, a G-band multi-SEB electron optical system (EOS) is presented, depicting that multiple paralleled SEBs can all stably propagate through the narrow tunnel without interceptions. Further investigation demonstrates that this new method can apply to EOS launched with an arbitrary number of SEBs with any preset clearance. In addition, the fabrication and measurement of this compact focusing structure are presented, experimentally confirming that the proposed Open PCM-NMSB can indeed generate the desired magnetic field, which surely facilitates the development of multi-SEB TWT or other similar vacuum electron devices.
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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