Enhanced wide band spectral photodetection (UV-NIR) and high detectivity investigated in topological p-TlBiSe2/n-ITO heterojunction

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Gyanendra Kumar Maurya , Sandeep Kumar Verma , Roshani Singh , Satendra Kumar , Vipin Kumar , Rachana Kumar , Pramod Kumar
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引用次数: 0

Abstract

Heterojunctions comprised of topological insulator material such as TlBiSe2 have sparked intense study attention due to their diverse and unique characteristics and functionalities. The emergence of topological heterojunction can result in a p-n junction at the interfaces having a strong crucial potential barrier that enhances the photodetection capabilities of topological insulators. This study enlightens the successful fabrication and characterization of a novel heterojunction photodetector based on topological insulator p-TlBiSe2/n-ITO, demonstrated remarkable photodetection abilities across a wide spectral range from ultraviolet (UV) to near-infrared (NIR). The unique topological properties of TlBiSe2, combined with the excellent conductivity of ITO, contribute to enhanced responsivity and detectivity. Detailed analysis revealed high photodetection performance, with strong spectral responsivity, external quantum efficiency, and fast response time in detecting wavelengths ranging from 200 nm to 1000 nm, The high value of responsivity 1357 A/W and impressive detectivity value of 2.89×1012 Jones makes this heterojunction highly suitable for applications requiring broad-spectrum detection. These findings highlight the potential of p-TlBiSe2/n-ITO heterojunctions for next-generation photodetectors in UV and NIR applications, offering a promising platform for future optoelectronic devices.

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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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