High resistive switching current ratio, excellent endurance and stability for bistable non-volatile memristor and photosensing devices based on perovskite/titanium dioxide embedded in polyvinyl alcohol matrix

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Garima Poply , Manisha , Deepak Kumar , Tanmoy Majumder , Tanuj Kumar , Vishal Singh , Jugal Bori , Jehova Jire L. Hmar
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Abstract

This study demonstrates the excellent endurance and stability of a high resistive switching current ratio for bistable non-volatile memristor and photosensing of a fabricated CH3NH3PbBr3-TiO2/PVA/FTO-coated glass substrate. Structural, optical, and electrical properties of fabricated devices TiO2/PVA/FTO-coated glass substrate (D1), CH3NH3PbBr3/PVA/FTO-coated glass substrate (D2), and CH3NH3PbBr3-TiO2/PVA/FTO-coated glass substrate (D3) were examined in detail. The current-voltage (I-V) characteristic of device D3 shows the bistable non-volatile resistive switching memory having an ON/OFF current ratio of ∼107 for over 5000 sweeping cycles. Device D3 exhibited a significantly higher ON/OFF current ratio compared to devices D1 and D2. Additionally, its operating voltage was substantially lower than that of the control samples D1 and D2, making it highly suitable for low-power electronic applications. Moreover, the stability and retention measurements were performed for device D3 in terms of resistance; the ON/OFF resistance ratio was found to be ∼107 at a read voltage of 1V. The device D3 maintained excellent stability even after continuous operation for ∼105 s, with no significant signs of degradation. Hence, the device D3 has good endurance, stability, and a high resistive switching current ratio, which is suitable for rewriteable non-volatile memristors. Furthermore, the photocurrent, photo-detectivity, and photoresponsivity of the same devices D1, D2, and D3 were studied under broadband light illumination with an intensity of 100 mW/cm2. Interestingly, it has been observed that the three devices show a good response of photocurrent at different voltages. The device D3 exhibited superior performance compared to D1 and D2. The values of current density under dark and light of device D3 are found to be ∼1.98 × 10−8 A/cm2 and ∼2.53 × 10−5 A/cm2, respectively, with the corresponding ON/OFF current ratio as ∼1277. This is due to the combination of perovskite CH3NH3PbBr3 and TiO2 and enhanced electron-hole pair generation, resulting in increasing the concentration of the charge carrier. The responsivity and photodetectivity of devices exhibit a similar trend as photocurrent. The maximum values of responsivity and photodetectivity of device D3 have been obtained at 1V and found to be ∼2.52 × 10−2 A/W and ∼3.15 × 1011 Hz1/2/W, respectively. Therefore, this device D3 also has the potential to be used for photosensing devices. Hence, the fabricated device D3 has excellent endurance, stability, high resistive switching current ratio, and photoresponse, which makes it an outstanding candidate for non-volatile memristor and photosensing applications.

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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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