Optimized Liquid Impinging Jet Arrays for Cooling CPU Packages

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
J. W. Elliott;A. J. Robinson
{"title":"Optimized Liquid Impinging Jet Arrays for Cooling CPU Packages","authors":"J. W. Elliott;A. J. Robinson","doi":"10.1109/TCPMT.2024.3485478","DOIUrl":null,"url":null,"abstract":"This study investigates optimization of the thermal-hydraulic performance of liquid impinging jet arrays for cooling of concentrated heat sources with an integrated heat spreader (IHS), mimicking a typical high-powered CPU package. Three heat source sizes were investigated, namely <inline-formula> <tex-math>$10\\times 10$ </tex-math></inline-formula> mm2, <inline-formula> <tex-math>$15\\times 15$ </tex-math></inline-formula> mm2, and <inline-formula> <tex-math>$20\\times 20$ </tex-math></inline-formula> mm2, all with a 1.3 mm thick copper heat spreader. An automated optimization workflow was developed in a computational fluid dynamics (CFD)-based environment to determine the ideal geometric design parameters of the impinging jet array heat exchangers, with the objective functions chosen to minimize hydraulic power consumption and/or minimize the overall thermal resistance, representing both single and multiobjective optimization strategies. The analysis showed that for maximizing the heat transfer performance only, the design tended to favor fewer closely spaced and higher velocity jets that targeted a concentrated region within the footprint on the heat spreader that was commensurate with the heat source. This focused the high convective intensity of the impinging jets on the central region of the heat spreader where the highest heat flux levels exist. However, the high jet velocities incurred a comparatively high hydraulic pumping power penalty. Conversely, when minimizing both thermal resistance and hydraulic power consumption simultaneously, the design favored a much higher population of lower velocity jets in order to mitigate the pressure drop and reduce the hydraulic power. Here, despite the lower convective cooling intensity of the lower velocity jets, the designs leveraged a much larger surface area of the heat spreader, which tended to maintain high heat transfer performance with disproportionately lower hydraulic penalties.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 3","pages":"488-505"},"PeriodicalIF":2.3000,"publicationDate":"2024-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10731867","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10731867/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

This study investigates optimization of the thermal-hydraulic performance of liquid impinging jet arrays for cooling of concentrated heat sources with an integrated heat spreader (IHS), mimicking a typical high-powered CPU package. Three heat source sizes were investigated, namely $10\times 10$ mm2, $15\times 15$ mm2, and $20\times 20$ mm2, all with a 1.3 mm thick copper heat spreader. An automated optimization workflow was developed in a computational fluid dynamics (CFD)-based environment to determine the ideal geometric design parameters of the impinging jet array heat exchangers, with the objective functions chosen to minimize hydraulic power consumption and/or minimize the overall thermal resistance, representing both single and multiobjective optimization strategies. The analysis showed that for maximizing the heat transfer performance only, the design tended to favor fewer closely spaced and higher velocity jets that targeted a concentrated region within the footprint on the heat spreader that was commensurate with the heat source. This focused the high convective intensity of the impinging jets on the central region of the heat spreader where the highest heat flux levels exist. However, the high jet velocities incurred a comparatively high hydraulic pumping power penalty. Conversely, when minimizing both thermal resistance and hydraulic power consumption simultaneously, the design favored a much higher population of lower velocity jets in order to mitigate the pressure drop and reduce the hydraulic power. Here, despite the lower convective cooling intensity of the lower velocity jets, the designs leveraged a much larger surface area of the heat spreader, which tended to maintain high heat transfer performance with disproportionately lower hydraulic penalties.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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