Mission Profile-Based Hotspot Temperature and Lifespan Estimation of DC-Link Capacitors Used in Automotive Traction Inverters

IF 2.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Device and Materials Reliability Pub Date : 2024-12-27 DOI:10.1109/TDMR.2024.3523341

Kaining Kuang;Xinhua Guo;Zhengyan Zhou;Chunzhen Li;Xiuwan Li

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引用次数: 0

Abstract

In electric vehicles (EVs), film capacitors are installed in the traction inverter to reduce ripple current. However, the lifespan of commercial film capacitors is highly sensitive to temperature fluctuations. The high ambient temperature within the traction inverter often leads to the premature failure of these capacitors, severely impacting the reliability of the traction drive system. In existing studies, the internal losses of capacitors have often been treated as constant, overlooking variations caused by changes in operating conditions and aging, which results in discrepancies between predicted and actual lifespans. This paper first proposes a new finite element analysis (FEA) modelling strategy to more accurately determine the hotspot temperature rise by considering the distribution of losses within the capacitor core. Next, based on the Federal Testing Procedure -75 (FTP-75) driving cycle, the operating profile of capacitors during EV operation is obtained. Following that, the cumulative damage of the capacitor is evaluated according to Miner’s rule, and the lifespan of the film capacitors is assessed. This method can offer a reference for capacitor replacements planning.

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来源期刊

IEEE Transactions on Device and Materials Reliability 工程技术-工程：电子与电气

CiteScore

4.80

自引率

5.00%

发文量

审稿时长

6-12 weeks

期刊介绍： The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.