{"title":"A Gate-Level SER Estimation Tool With Event-Driven Dynamic Timing and SET Height Consideration","authors":"Georgios-Ioannis Paliaroutis;Pelopidas Tsoumanis;Dimitrios Garyfallou;Anastasis Vagenas;Nestor Evmorfopoulos;Georgios Stamoulis","doi":"10.1109/TDMR.2024.3508696","DOIUrl":null,"url":null,"abstract":"Radiation-induced soft errors in Integrated Circuits (ICs) have always been a matter of great reliability concern. However, the ongoing shrinking of CMOS technology nodes, which results in high frequency, low power, and small area exacerbates the problem. Thus, accurate evaluation of the ICs’ vulnerability to such errors has become crucial, especially when a radiation-hardening process is developed. In this article, we present a gate-level Soft Error Rate (SER) estimation framework based on an event-driven approach that models the generated Single Event Transients (SETs) as event pairs that propagate through the circuit. Dynamic Timing Analysis (DTA) is performed to estimate SET arrival times at Flip-Flop (FF) inputs and detect a soft error. Moreover, our approach approximates the glitch height and considers the noise immunity thresholds of gates to evaluate potential SET electrical masking. Additionally, our event-driven framework enables accurate propagation of Single Event Multiple Transients (SEMTs), which have become commonplace in combinational circuits. Experimental evaluation on ISCAS ’89 benchmarks indicates that the proposed event-driven height-aware approach exhibits 21.06% more accurate SER estimation on average, compared to conventional graph-based techniques, with respect to SPICE simulation. F1 scores further strengthen the previous result, demonstrating an average improvement of 11.86%. In terms of failures in time, experimental results show that the graph-based approach overestimates SER by an average of 8558 and up to 16485 errors compared to the proposed method. Finally, our approach is used to effectively identify the most sensitive gates that could potentially be hardened in a SER mitigation scenario.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 1","pages":"17-26"},"PeriodicalIF":2.5000,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10770261/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Radiation-induced soft errors in Integrated Circuits (ICs) have always been a matter of great reliability concern. However, the ongoing shrinking of CMOS technology nodes, which results in high frequency, low power, and small area exacerbates the problem. Thus, accurate evaluation of the ICs’ vulnerability to such errors has become crucial, especially when a radiation-hardening process is developed. In this article, we present a gate-level Soft Error Rate (SER) estimation framework based on an event-driven approach that models the generated Single Event Transients (SETs) as event pairs that propagate through the circuit. Dynamic Timing Analysis (DTA) is performed to estimate SET arrival times at Flip-Flop (FF) inputs and detect a soft error. Moreover, our approach approximates the glitch height and considers the noise immunity thresholds of gates to evaluate potential SET electrical masking. Additionally, our event-driven framework enables accurate propagation of Single Event Multiple Transients (SEMTs), which have become commonplace in combinational circuits. Experimental evaluation on ISCAS ’89 benchmarks indicates that the proposed event-driven height-aware approach exhibits 21.06% more accurate SER estimation on average, compared to conventional graph-based techniques, with respect to SPICE simulation. F1 scores further strengthen the previous result, demonstrating an average improvement of 11.86%. In terms of failures in time, experimental results show that the graph-based approach overestimates SER by an average of 8558 and up to 16485 errors compared to the proposed method. Finally, our approach is used to effectively identify the most sensitive gates that could potentially be hardened in a SER mitigation scenario.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.