{"title":"In-Field Testing of Functionally-Possible Transition Faults With High Activation Frequencies","authors":"Irith Pomeranz;Yervant Zorian","doi":"10.1109/TDMR.2024.3468710","DOIUrl":null,"url":null,"abstract":"Motivated by the reliability requirements of chips in state-of-the-art technologies, this article develops an approach to periodic in-field testing that has the following features. The faults targeted are functionally-possible transition faults, implying that the faults can affect the correct functional operation of a chip. The fault sites in areas of the chip with higher switching activities during functional operation are considered important to target more often. This is because a higher switching activity can lead to faster aging, and therefore, a higher likelihood for defects. Under the approach described in this article, the computation of the functional switching activity, the identification of functionally-possible transition faults, and the generation of tests that are applicable in-field, are performed using the same set of functional test sequences. Experimental results for benchmark circuits demonstrate that small numbers of tests are sufficient for detecting functionally-possible transition faults in areas with high switching activities, making it possible to apply the tests frequently during the lifetime of the chip.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 1","pages":"4-10"},"PeriodicalIF":2.5000,"publicationDate":"2024-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10695770/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Motivated by the reliability requirements of chips in state-of-the-art technologies, this article develops an approach to periodic in-field testing that has the following features. The faults targeted are functionally-possible transition faults, implying that the faults can affect the correct functional operation of a chip. The fault sites in areas of the chip with higher switching activities during functional operation are considered important to target more often. This is because a higher switching activity can lead to faster aging, and therefore, a higher likelihood for defects. Under the approach described in this article, the computation of the functional switching activity, the identification of functionally-possible transition faults, and the generation of tests that are applicable in-field, are performed using the same set of functional test sequences. Experimental results for benchmark circuits demonstrate that small numbers of tests are sufficient for detecting functionally-possible transition faults in areas with high switching activities, making it possible to apply the tests frequently during the lifetime of the chip.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.