Finite-Element Analysis and Multiobjective Optimization of Solder Joint Temperature Difference and Cooling Stress During PCBA Reflow Process

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-01-14 DOI:10.1109/TCPMT.2025.3529292

Jingyi Lan;Chunyue Huang;Ying Liang;Chao Gao;Gui Wang;Zhiqin Cao

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引用次数: 0

Abstract

A finite-element analysis model of a printed circuit board assembly (PCBA) was established. The model was subjected to a reflow soldering temperature profile to analyze the temperature distribution at the solder joint solidification moment and the cooling stress distribution at the end of the reflow soldering process. Validation experiments confirmed the accuracy of the simulation results. The response surface methodology (RSM) combined with the NSGA-II algorithm was employed to optimize the reflow soldering process parameters with the dual objectives of minimizing solder joint temperature difference and cooling stress. The results reveal uneven temperature distribution at the solder joint solidification onset and concentrated cooling stress due to the mismatch in thermal expansion coefficients. The optimized reflow soldering process parameters were determined as: soak time of 80 s, reflow time of 35 s, reflow temperature of

$230~^{\circ }$

C, and cooling rate of

$2~^{\circ }$

C/s. Simulation validation demonstrated that with the optimal reflow soldering process parameters, the solder joint temperature difference and cooling stress were reduced by

$1.058~^{\circ }$

C and 1.245 MPa, respectively. The results of this study on the optimization of the reflow soldering process parameters of the PCBA have a certain degree of significance in guiding.

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PCBA 回流焊过程中焊点温差和冷却应力的有限元分析与多目标优化

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.