Design of Multifunctional Multiway Filtering Power Dividers Based on Tri-Mode Resonators

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Chi-Feng Chen;Yu-Sheng Zeng;Yi-Chen Yeh;Tsang-Ning Tien;Ruo-Yin Yang;Chun-Hsiang Lo
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引用次数: 0

Abstract

This article presents an innovative design methodology for multiway filtering power dividers that can perform both power splitting and filtering functions in a compact package. In this methodology, tri-mode resonators are used to achieve circuit miniaturization and a wide stopband. To validate the methodology, the four-, six-, and eight-way filtering power dividers based on tri-mode stub-loaded resonators were designed and fabricated; their circuit areas were small at $0.089\lambda _{g}^{2}$ , $0.108\lambda _{g}^{2}$ , and $0.102\lambda _{g}^{2}$ , respectively. The study determined that introducing additional transmission zeros can enhance the frequency selectivity and stopband attenuation. Furthermore, incorporating appropriate resistors can improve the output port return losses and port-to-port isolation. Finally, both simulations and experimental measurements confirmed that the proposed multiway filtering power dividers are compact and have high frequency selectivity, high isolation, and wide stopbands, making them suitable for modern wireless communication systems.
基于三模谐振器的多功能多路滤波功率分配器的设计
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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