High Sensitivity Temperature Measurements to Track and Compensate Aging Effects on CMOS Amplifiers

IF 2.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Device and Materials Reliability Pub Date : 2024-09-23 DOI:10.1109/TDMR.2024.3465236

Diego Mateo;Xavier Aragones;Enrique Barajas;Sergio Martínez Domingo;Xavier Gisbert;Josep Altet

引用次数: 0

Abstract

This article presents a method to monitor and compensate gain degradation produced by aging in linear CMOS amplifiers. The proposed procedure relies on a stand-alone temperature sensor circuit. DC measurements at the output of the temperature sensor allow to monitor high-frequency gain, and to select an adaptive biasing to keep a constant gain along the circuit lifetime. The approach is validated experimentally on a high-frequency Power Amplifier, which was subjected to an accelerated aging degradation. Experimental results demonstrate the capability to keep the amplifier gain within 0.3 dB from its fresh value, even after important device aging degradation.

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通过高灵敏度温度测量跟踪和补偿 CMOS 放大器的老化效应

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Device and Materials Reliability 工程技术-工程：电子与电气

CiteScore

4.80

自引率

5.00%

发文量

审稿时长

6-12 weeks

期刊介绍： The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.