DUV-NIR dual-band photodetector based on Ga2O3/GaAs heterogeneous junctions

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Chenrui Shang , Rongrong Chen , Wei Mi , Jinpei Wang , Qing Li , Jinlong Liang , Xiangcan Kong , Di Wang , Lin'an He , Liwei Zhou , Zhaolong Chen , Jinshi Zhao
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引用次数: 0

Abstract

In this work, we demonstrate dual band vertical heterojunction photodetector realized by integrating Ga2O3 with n-type GaAs. For comparison, we fabricated Ga2O3/GaAs Heterogeneous junction metal-semiconductor-metal photodetectors (MSM PD). The Ga2O3/GaAs devices show two distinct detection peaks in spectral responsivity, one at 255 nm and another at 830 nm. Under the ultraviolet (UV) light illumination at 254 nm, at a biasing voltage of 10 V, an ultra-low dark current (Idark) of 3.5 × 10−9 A, a high photo-to-dark current ratio (PDCR) of 8.7 × 102, a responsivity(R) of ∼25.8 A/W, a specific detectivity (D∗) of 4.2 × 1013 Jones are achieved. And PDCR is 2.7 × 102, R is ∼0.45 A/W and D∗ is 7.3 × 1011 under the infrared(IR) light illumination at 830 nm, at the same biasing voltage of the device. Compared to single-layer Ga2O3 and GaAs MSM PDs, Ga2O3/GaAs devices are capable of responding to the UV/IR bands simultaneously, while increasing the responsivity from 5.9 A/W to 25.8 A/W and the D∗ from 1.7 × 1012 Jones to 4.2 × 1013 Jones under UV irradiation. Meanwhile, the dual-band photodetector based on Ga2O3/GaAs Heterogeneous junctions shows good stability and reproducibility. Our results present a new avenue for designing multifunctional photodetectors, enabling operation in complex environments.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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