Fast and high-resolution X-ray nano tomography for failure analysis in advanced packaging

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-03-14 DOI:10.1016/j.microrel.2025.115694

T. Dreier, D. Nilsson, J. Hållstedt

{"title":"Fast and high-resolution X-ray nano tomography for failure analysis in advanced packaging","authors":"T. Dreier, D. Nilsson, J. Hållstedt","doi":"10.1016/j.microrel.2025.115694","DOIUrl":null,"url":null,"abstract":"<div><div>Advanced packaging in electronics involves integrating semiconductor devices and sensors into a unified package, often employing complex 3D structures for enhanced performance and efficiency. As electronic components become smaller and more densely packed, conventional 2D X-ray radiography is not sufficient for inspection. Here we demonstrate the use of nano-CT with a high bandwidth memory (HBM) example illustrating the potential of fast detection of sub-micron voids and cracks in micro-bumps. Using a 30 s overview scan at 2.6 μm voxel size for navigation, a region is selected for a high-resolution scan with a voxel size of 600 nm to analyse 20 μm micro-bumps in between DRAM layers. Additionally, high-resolution laminography is performed showing the differences of the 2 techniques. The results show how high-resolution nano-CT can effectively be used for fast failure analysis and R&D as well as important feedback to production ramp up and yield improvements of advanced packaging technologies.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"168 ","pages":"Article 115694"},"PeriodicalIF":1.6000,"publicationDate":"2025-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425001076","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

Advanced packaging in electronics involves integrating semiconductor devices and sensors into a unified package, often employing complex 3D structures for enhanced performance and efficiency. As electronic components become smaller and more densely packed, conventional 2D X-ray radiography is not sufficient for inspection. Here we demonstrate the use of nano-CT with a high bandwidth memory (HBM) example illustrating the potential of fast detection of sub-micron voids and cracks in micro-bumps. Using a 30 s overview scan at 2.6 μm voxel size for navigation, a region is selected for a high-resolution scan with a voxel size of 600 nm to analyse 20 μm micro-bumps in between DRAM layers. Additionally, high-resolution laminography is performed showing the differences of the 2 techniques. The results show how high-resolution nano-CT can effectively be used for fast failure analysis and R&D as well as important feedback to production ramp up and yield improvements of advanced packaging technologies.

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.