{"title":"Resonant fatigue test performance of battery pack connections using wire bonding","authors":"Xing Wei, Junko Takahashi, Kohei Tatsumi","doi":"10.1016/j.microrel.2025.115705","DOIUrl":null,"url":null,"abstract":"<div><div>Reliable interconnections in electric vehicle (EV) battery packs are critical for performance and safety. Wire bonding enables joining dissimilar materials with minimal heat input but suffers from limited joint strength under vibrational stress. Existing testing standards focus on entire battery packs, lacking direct assessment of bonding wire reliability. This study proposes a novel resonance-based fatigue testing method to evaluate the fatigue resistance of aluminum (Al), silver (Ag), and copper (Cu) bonding wires (200 μm in diameter). Results show that Ag and Cu wires significantly outperform Al wire under high-frequency vibration. At 1 mm amplitude, Al wire failed immediately, while Ag and Cu wires survived ∼200,000 and ∼ 300,000 cycles, respectively. In a 10-million-cycle test at 0.6 mm amplitude, Ag and Cu wires exhibited excellent fatigue resistance, whereas Al wire fractured before 60,000 cycles. SEM analysis revealed severe cracking in Al wire after 30,000 cycles, while Ag and Cu wires showed only minor cracks after 10 million cycles. Although Cu wire demonstrated the highest fatigue resistance, its higher bonding temperature is a limitation, making Ag wire a promising alternative. The proposed method offers an effective approach to assessing bonding wire reliability, aiding material selection for enhanced EV battery durability.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"168 ","pages":"Article 115705"},"PeriodicalIF":1.6000,"publicationDate":"2025-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425001180","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Reliable interconnections in electric vehicle (EV) battery packs are critical for performance and safety. Wire bonding enables joining dissimilar materials with minimal heat input but suffers from limited joint strength under vibrational stress. Existing testing standards focus on entire battery packs, lacking direct assessment of bonding wire reliability. This study proposes a novel resonance-based fatigue testing method to evaluate the fatigue resistance of aluminum (Al), silver (Ag), and copper (Cu) bonding wires (200 μm in diameter). Results show that Ag and Cu wires significantly outperform Al wire under high-frequency vibration. At 1 mm amplitude, Al wire failed immediately, while Ag and Cu wires survived ∼200,000 and ∼ 300,000 cycles, respectively. In a 10-million-cycle test at 0.6 mm amplitude, Ag and Cu wires exhibited excellent fatigue resistance, whereas Al wire fractured before 60,000 cycles. SEM analysis revealed severe cracking in Al wire after 30,000 cycles, while Ag and Cu wires showed only minor cracks after 10 million cycles. Although Cu wire demonstrated the highest fatigue resistance, its higher bonding temperature is a limitation, making Ag wire a promising alternative. The proposed method offers an effective approach to assessing bonding wire reliability, aiding material selection for enhanced EV battery durability.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.