{"title":"Processing quality prediction and multi-objective optimization of polysilicon wire-EDM","authors":"Hongfei Gao, Yadong Gong, Rongdi Zhu, Liya Jin","doi":"10.1016/j.mssp.2025.109462","DOIUrl":null,"url":null,"abstract":"<div><div>Wire electrical discharge machining (wire-EDM) has recently been applied in the cutting of polysilicon ingots. However, the challenge of achieving a balance among processing quality, efficiency, and material waste has imposed limitations on its practical industrial application. In this paper, the Dung Beetle Optimizer (DBO) was employed to optimize the weights and thresholds of a back propagation neural network (BPNN) to construct a DBO-BP prediction model. This prediction model was developed to establish a non-linear mapping relationship between process parameters (open voltage, pulse width, pulse interval ratio, wire speed, and feed velocity) and process indicators (surface roughness and material removal rate). Furthermore, a DBO-BP-PSO multi-objective optimization model was developed by coupling with the Multi-objective Particle Swarm Optimization (MOPSO). This model aimed to minimize surface roughness and kerf width while maximizing material removal rate, thereby determining the optimization combinations of process parameters. The Pareto optimal solution set was obtained through solving this model. The results of further verification experiments demonstrated that the DBO-BP-PSO multi-objective optimization model was capable of effectively achieving precise prediction and optimization of the processing results in polysilicon wire-EDM.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"192 ","pages":"Article 109462"},"PeriodicalIF":4.2000,"publicationDate":"2025-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125001994","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Wire electrical discharge machining (wire-EDM) has recently been applied in the cutting of polysilicon ingots. However, the challenge of achieving a balance among processing quality, efficiency, and material waste has imposed limitations on its practical industrial application. In this paper, the Dung Beetle Optimizer (DBO) was employed to optimize the weights and thresholds of a back propagation neural network (BPNN) to construct a DBO-BP prediction model. This prediction model was developed to establish a non-linear mapping relationship between process parameters (open voltage, pulse width, pulse interval ratio, wire speed, and feed velocity) and process indicators (surface roughness and material removal rate). Furthermore, a DBO-BP-PSO multi-objective optimization model was developed by coupling with the Multi-objective Particle Swarm Optimization (MOPSO). This model aimed to minimize surface roughness and kerf width while maximizing material removal rate, thereby determining the optimization combinations of process parameters. The Pareto optimal solution set was obtained through solving this model. The results of further verification experiments demonstrated that the DBO-BP-PSO multi-objective optimization model was capable of effectively achieving precise prediction and optimization of the processing results in polysilicon wire-EDM.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.