Enabling Printed Multilayer Perceptrons Realization via Area-Aware Neural Minimization

IF 3.6 2区 计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Argyris Kokkinis;Georgios Zervakis;Kostas Siozios;Mehdi Baradaran Tahoori;Jörg Henkel
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引用次数: 0

Abstract

Printed Electronics (PE) set up a new path for the realization of ultra low-cost circuits that can be deployed in every-day consumer goods and disposables. In addition, PE satisfy requirements such as porosity, flexibility, and conformity. However, the large feature sizes in PE and limited device counts incur high restrictions and increased area and power overheads, prohibiting the realization of complex circuits. As a result, although printed Machine Learning (ML) circuits could open new horizons and bring “intelligence” in such domains, the implementation of complex classifiers, as required in target applications, is hardly feasible. In this paper, we aim to address this and focus on the design of battery-powered printed Multilayer Perceptrons (MLPs). To that end, we exploit fully-customized circuit (bespoke) implementations, enabled in PE, and propose a hardware-aware neural minimization framework dedicated for such customized MLP circuits. Our evaluation demonstrates that, for up to 3% accuracy loss, our co-design methodology enables, for the first time, battery-powered operation of complex printed MLPs.
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来源期刊
IEEE Transactions on Computers
IEEE Transactions on Computers 工程技术-工程:电子与电气
CiteScore
6.60
自引率
5.40%
发文量
199
审稿时长
6.0 months
期刊介绍: The IEEE Transactions on Computers is a monthly publication with a wide distribution to researchers, developers, technical managers, and educators in the computer field. It publishes papers on research in areas of current interest to the readers. These areas include, but are not limited to, the following: a) computer organizations and architectures; b) operating systems, software systems, and communication protocols; c) real-time systems and embedded systems; d) digital devices, computer components, and interconnection networks; e) specification, design, prototyping, and testing methods and tools; f) performance, fault tolerance, reliability, security, and testability; g) case studies and experimental and theoretical evaluations; and h) new and important applications and trends.
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