Defect evolution in gallium oxide during stretching process: A molecular dynamics simulation

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Rui Li , Zijun Qi , Zhanpeng Sun , Biao Meng , Wei Shen , Zhaofu Zhang , Gai Wu
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引用次数: 0

Abstract

Gallium oxide (Ga2O3) is a new generation ultra-wide bandgap semiconductor material with excellent properties such as high electron mobility, high-voltage electrical response speed, and radiation resistance. However, few reports currently exist on the nanomechanical properties of Ga2O3. In this study, a potential function of Ga2O3 can be used to describe α-, β- and ε-phases was developed through machine learning approach. Based on the developed potential function, the mechanical properties and defect evolution of Ga2O3 under different crystal structures, defects, and temperatures were thoroughly studied. The results indicate that the mechanical properties of Ga2O3 with different crystal phases exhibit significant anisotropy. Among them, the α phase Ga2O3 endures the largest deformation force, and the β phase undergoes the highest deformation. Upon loading α-Ga2O3, the slip phase transition occurs, whereas, for the β- and ε-Ga2O3, the amorphous phase transition occurs directly along the fracture interface without slip phase transition. Ga2O3 exhibits typical brittle fracture during tensile fracture. The adhesion degree of atoms at the fracture interface increases with the rise of temperature. The existence of defects in Ga2O3 changes the direction of phase transformation slip during the tensile fracture. The increased temperature leads to an increase in the proportion of amorphous phase transformation of Ga2O3 during stretching, but the proportion of bond breakage shows an overall downward trend.

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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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