Zijian Guo , Hao Chen , Yifan Hu , Ji Jiang , Xuerong Ye
{"title":"Reliability prediction of electronic components based on physical of failure with manufacturing parameters fluctuations","authors":"Zijian Guo , Hao Chen , Yifan Hu , Ji Jiang , Xuerong Ye","doi":"10.1016/j.microrel.2025.115662","DOIUrl":null,"url":null,"abstract":"<div><div>Reliability prediction based on the physics of failure (PoF) methodology involves examining the physical variables that impact the performance parameters of electronic components, developing mathematical models to describe the evolution of these parameters, and predicting the components' reliable operational lifespan. However, the current PoF model does not account for the influence of manufacturing parameters, such as material properties and structural characteristics, which limits the accuracy of reliability predictions. Therefore, establishing a PoF model that incorporates manufacturing parameters is a critical challenge in enhancing reliability prediction accuracy. To overcome this limitation, an improved PoF model incorporating manufacturing parameters is proposed in this study. The study examines how the manufacturing parameters influence the PoF model, then develops an adapted PoF model that incorporates these factors for improved predictive accuracy. Then, a parameter estimation method based on Long Short-Term Memory (LSTM) is proposed, with the Hybrid Bat Algorithm (HBA) employed to adaptively optimize the network's parameters. Finally, the effectiveness of the proposed method is demonstrated through a case study on an electromagnetic relay. Compared to the actual lifespan, the reliability prediction model incorporating manufacturing parameters accurately estimates the relay's lifetime, achieving deviation of only 5.8 % at 100,000 cycles, thereby verifying the model is feasibility and effectiveness.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"168 ","pages":"Article 115662"},"PeriodicalIF":1.6000,"publicationDate":"2025-03-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425000757","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Reliability prediction based on the physics of failure (PoF) methodology involves examining the physical variables that impact the performance parameters of electronic components, developing mathematical models to describe the evolution of these parameters, and predicting the components' reliable operational lifespan. However, the current PoF model does not account for the influence of manufacturing parameters, such as material properties and structural characteristics, which limits the accuracy of reliability predictions. Therefore, establishing a PoF model that incorporates manufacturing parameters is a critical challenge in enhancing reliability prediction accuracy. To overcome this limitation, an improved PoF model incorporating manufacturing parameters is proposed in this study. The study examines how the manufacturing parameters influence the PoF model, then develops an adapted PoF model that incorporates these factors for improved predictive accuracy. Then, a parameter estimation method based on Long Short-Term Memory (LSTM) is proposed, with the Hybrid Bat Algorithm (HBA) employed to adaptively optimize the network's parameters. Finally, the effectiveness of the proposed method is demonstrated through a case study on an electromagnetic relay. Compared to the actual lifespan, the reliability prediction model incorporating manufacturing parameters accurately estimates the relay's lifetime, achieving deviation of only 5.8 % at 100,000 cycles, thereby verifying the model is feasibility and effectiveness.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.