On the validity of rainflow counting-based lifetime assessment for power electronics assembly

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-03-10 DOI:10.1016/j.microrel.2025.115651

D. Zhao, S. Letz, J. Leib, B. Eckardt

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Abstract

The lifetime assessment of power electronics based on mission profiles is increasingly applied to obtain realistic lifetime predictions while considering application-close operational scenarios. Generally, mission profile-based lifetime is calculated by individual temperature cycles disassembled from the mission profiles using specific counting methods. Among the different methods, rainflow counting (RC) method is the most common algorithmic procedure for determining damage-relevant events in power electronics. However, the conventional RC method does not consider the mechanical sequential effect and transient effect on damage caused by time-dependent material properties, especially at high temperatures during power module operation. In this paper, we investigate the validity of using the RC method for mission profile-based lifetime assessment of power modules. Through finite element (FE) modeling, we explicitly calculate both effects driven by the mission profile. For the selected mission profiles, we find that the lifetime of bond wire calculated by the FE approach shows a difference of 9 %, which cannot be sensed by the conventional RC approach. Furthermore, through a comparison between different approaches, it appears that the lifetime calculated by the RC approach is higher than the lifetime assessed by the FE approach by around 20 %. Simultaneously at the solder, the deviation between both approaches reaches around 95 %.

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.