PBO delamination and RDL corrosion detection on WLCSP package products

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-03-09 DOI:10.1016/j.microrel.2025.115645

K. Bidaj , Y. Chen , J. Chang , O. Atance-Loustaunau , F. Braud , M. Medda

引用次数: 0

Abstract

This paper presents a novel approach based on physical failures instead of electrical failures for PBO delamination and RDL corrosion detection.

Moreover, most effective reliability stress to generate such failure mechanisms are presented through theory and experimental trials.

This study can serve as a guideline for selecting the best reliability stress to detect PBO delamination or RDL corrosion issues in future qualifications.

查看原文本刊更多论文

求助全文

约1分钟内获得全文求助全文

来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.