{"title":"Reliability assurance in foldable displays: Design of experiment-based testing strategy for market-ready products","authors":"U.H. Jeong , S.Y. Lim , S.S. Han","doi":"10.1016/j.microrel.2025.115673","DOIUrl":null,"url":null,"abstract":"<div><div>Foldable displays have many moving parts and can operate in different environments. These conditions lead to potential interactions between diverse failure mechanisms and stresses, making reliability assurance a major challenge. Ensuring reliability while considering all these potential failure mechanisms and stresses is very challenging. This paper introduces a method for efficiently evaluating the reliability and lifespan of foldable displays. First, potential failure modes associated with foldable displays were identified, and corresponding influencing factors were determined. In addition to the fundamental stress factor of repetitive folding, temperatures, humidity, and temperature changes were chosen as influencing factors. To assess the influence of these factors on the display performance, two levels of stress severity were selected. Using these three factors and two stress levels, experiments were conducted using the design of experiments (DOE) method. The test results intuitively revealed the principal effects of each stress factor on the final quality and performance of the display. We found that low temperatures and temperature changes can affect the catastrophic failure of the display panel, and the number of folds impacts the degradation of the hinge parts. The proposed DOE-based evaluation method provides an efficient and economical approach for assessing the reliability of foldable displays.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"168 ","pages":"Article 115673"},"PeriodicalIF":1.6000,"publicationDate":"2025-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425000861","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Foldable displays have many moving parts and can operate in different environments. These conditions lead to potential interactions between diverse failure mechanisms and stresses, making reliability assurance a major challenge. Ensuring reliability while considering all these potential failure mechanisms and stresses is very challenging. This paper introduces a method for efficiently evaluating the reliability and lifespan of foldable displays. First, potential failure modes associated with foldable displays were identified, and corresponding influencing factors were determined. In addition to the fundamental stress factor of repetitive folding, temperatures, humidity, and temperature changes were chosen as influencing factors. To assess the influence of these factors on the display performance, two levels of stress severity were selected. Using these three factors and two stress levels, experiments were conducted using the design of experiments (DOE) method. The test results intuitively revealed the principal effects of each stress factor on the final quality and performance of the display. We found that low temperatures and temperature changes can affect the catastrophic failure of the display panel, and the number of folds impacts the degradation of the hinge parts. The proposed DOE-based evaluation method provides an efficient and economical approach for assessing the reliability of foldable displays.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.