Investigation of humidity protection behavior of protective coatings on PCB with components

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-03-06 DOI:10.1016/j.microrel.2025.115672

Ioannis Mantis , Anish Rao Lakkaraju , Mike Bixenman , Kapil Kumar Gupta , Rajan Ambat

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Abstract

In this work, humidity performance of two types of protective coatings was investigated on a PCB with typical components with the aim of understanding synergistic effect of coating/process and board design. Coatings are 2-component Polyurethane (PU, mixture of Ether and Ester polyols) and ultra-thin Plasma enhanced chemical vapor deposition (PECVD) coating. Test PCB used for testing consisted of components such as a Quad flat no‑lead package (QFN), Ball grid array (BGA), and Pin connector. The performance of coated PCB was evaluated in terms of process-induced no-clean flux residues introduced during reflow and wave soldering of components. The test profile used was constant humidity (95 %) condition with temperature cycling (40°C–65°C). Moisture permeation through the coatings and its effects on component performance was evaluated using electrochemical AC impedance and subsequent DC potentiostatic measurement under climatic exposure. Coating-PCB-Components interfaces were analyzed using Scanning electron microscopy (SEM) and Energy dispersive spectroscopy (EDS) before and after testing. The study revealed that the PCBA cleanliness after a soldering process is a major factor determining the coating performance, component geometrical shape and standoff height affected uniformity of coating and under-filling affecting humidity performance.

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.