Sorption getter characterization under wafer-level packaging (WLP) conditions

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-03-05 DOI:10.1016/j.microrel.2025.115677

H. Duchemin, D. Bouchu

引用次数: 0

Abstract

Combination of Wafer Level Packaging (WLP) process with Non-Evaporated Getter (NEG) integration ensures the high-level vacuum hermetic packaging required for resonator based micro-electro-mechanical systems (MEMS) such as accelerometers or gyroscopes. In this article, we report a new characterization method to measure the NEG sorption efficiency under the replicated WLP process conditions, so as to ensure that the integration of NEG is well adapted to the overall MEMS fabrication process. We integrated this characterization protocol as a step in the MEMS process flow in order to ensure that the sealed getter remain fully functional through the WLP. Our approach is validated on hermetic packaged resonators, demonstrating an 80-fold quality factor (Q-factor) increase through NEG integration.

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晶圆级封装（WLP）条件下的吸收剂表征

晶圆级封装（WLP）工艺与非蒸发吸气器（NEG）集成的结合确保了基于谐振器的微机电系统（MEMS）（如加速度计或陀螺仪）所需的高水平真空密封封装。在本文中，我们报告了一种在复制WLP工艺条件下测量NEG吸收效率的新表征方法，以确保NEG的集成能够很好地适应整个MEMS制造工艺。我们将该表征协议集成为MEMS工艺流程中的一个步骤，以确保密封吸气剂在WLP中保持完全功能。我们的方法在密封封装谐振器上得到了验证，通过NEG集成，质量因子（q因子）提高了80倍。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.