{"title":"Sorption getter characterization under wafer-level packaging (WLP) conditions","authors":"H. Duchemin, D. Bouchu","doi":"10.1016/j.microrel.2025.115677","DOIUrl":null,"url":null,"abstract":"<div><div>Combination of Wafer Level Packaging (WLP) process with Non-Evaporated Getter (NEG) integration ensures the high-level vacuum hermetic packaging required for resonator based micro-electro-mechanical systems (MEMS) such as accelerometers or gyroscopes. In this article, we report a new characterization method to measure the NEG sorption efficiency under the replicated WLP process conditions, so as to ensure that the integration of NEG is well adapted to the overall MEMS fabrication process. We integrated this characterization protocol as a step in the MEMS process flow in order to ensure that the sealed getter remain fully functional through the WLP. Our approach is validated on hermetic packaged resonators, demonstrating an 80-fold quality factor (Q-factor) increase through NEG integration.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"168 ","pages":"Article 115677"},"PeriodicalIF":1.6000,"publicationDate":"2025-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425000903","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Combination of Wafer Level Packaging (WLP) process with Non-Evaporated Getter (NEG) integration ensures the high-level vacuum hermetic packaging required for resonator based micro-electro-mechanical systems (MEMS) such as accelerometers or gyroscopes. In this article, we report a new characterization method to measure the NEG sorption efficiency under the replicated WLP process conditions, so as to ensure that the integration of NEG is well adapted to the overall MEMS fabrication process. We integrated this characterization protocol as a step in the MEMS process flow in order to ensure that the sealed getter remain fully functional through the WLP. Our approach is validated on hermetic packaged resonators, demonstrating an 80-fold quality factor (Q-factor) increase through NEG integration.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.