Zhipeng Liu , Meixian Huang , Jianbo Shao , Chengming Song , Yusen Qin , Song Zhang , Qiqi Wang , Meilin Peng , Meiling Zhang , Guilin Liu , Xi Xi , Jingjia Ji
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引用次数: 0
Abstract
The shortcomings of traditional screen-printed technology in PV industry have rendered it inadequate for the demands of high power conversion efficiency solar cell design, including the low contact performance and the high shading area. Combinating laser ablation pretreatment and Ni/Cu plating can circumvent these issues. However, laser-induced damage significantly influences the further enhancement of power conversion efficiency of the solar cells with electroplating electrodes. In this paper, a simplified physical model of laser ablation on the rear surface dielectric layer for N-type tunnel oxide passivated contacts(TOPCon) solar cells was presented. According to model, the approximate calculation of the laser ablation power was between 0.2 W and 1.6 W, when a 355 nm ps Gaussian pulsed laser was employed on the rear surface of N-type TOPCon solar cells. Subsequently, the optimal laser ablation process parameters for the electroplating process on the rear surface of the wafer were identified through experiments. By modifying the laser ablation process, as far as possible to reduce the damage to the polycrystalline silicon passivation layer caused by the laser on the rear surface of the TOPCon solar cells. Following the modification of the laser ablation procedure, the laser-induced damage was also rectified through high-temperature annealing. Ultimately, a photoelectric conversion efficiency of 24.36 % was attained in the N-type electroplating TOPCon solar cells, representing an enhancement of 0.86%abs in comparison to that of the TOPCon solar cells with electrodes fabricated by screen-printed on the rear surface.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.