Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
M. Ghrabli , M. Bouarroudj , L. Chamoin , E. Aldea
{"title":"Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules","authors":"M. Ghrabli ,&nbsp;M. Bouarroudj ,&nbsp;L. Chamoin ,&nbsp;E. Aldea","doi":"10.1016/j.microrel.2025.115644","DOIUrl":null,"url":null,"abstract":"<div><div>This paper presents a new approach to estimate the remaining useful life of a power electronic module where failure is caused by degradation in the wire bonds. The novelty of this work is that estimation is given for each loading cycle as opposed to estimating only the number of cycles to failure. A direct consequence is that one can make predictions on variable loading profiles using the proposed method, whereas classical solutions assume periodic loading, which limits their applicability. Experimental data of failure tests are used alongside finite element simulation to mechanically describe the state of the power module at each cycle. Using these mechanical quantities, we iteratively infer how the degradation evolves using Markov chains until failure. A first machine learning algorithm is used to establish a relationship between the degradation and the health indicator, and a second algorithm is used as a surrogate model for finite element simulations to drastically reduce computational time. Results show high extrapolation and interpolation capabilities of the obtained model, meaning that precise predictions can be obtained from experimental data where loading conditions are significantly different from realistic conditions.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"167 ","pages":"Article 115644"},"PeriodicalIF":1.6000,"publicationDate":"2025-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425000575","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

This paper presents a new approach to estimate the remaining useful life of a power electronic module where failure is caused by degradation in the wire bonds. The novelty of this work is that estimation is given for each loading cycle as opposed to estimating only the number of cycles to failure. A direct consequence is that one can make predictions on variable loading profiles using the proposed method, whereas classical solutions assume periodic loading, which limits their applicability. Experimental data of failure tests are used alongside finite element simulation to mechanically describe the state of the power module at each cycle. Using these mechanical quantities, we iteratively infer how the degradation evolves using Markov chains until failure. A first machine learning algorithm is used to establish a relationship between the degradation and the health indicator, and a second algorithm is used as a surrogate model for finite element simulations to drastically reduce computational time. Results show high extrapolation and interpolation capabilities of the obtained model, meaning that precise predictions can be obtained from experimental data where loading conditions are significantly different from realistic conditions.

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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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