A Fully Flexible Wireless Passive Strain Sensor Utilizing an Ultra-Thin Quartz Surface Acoustic Wave Resonator

IF 4.1 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Electron Device Letters Pub Date : 2025-01-14 DOI:10.1109/LED.2025.3529686

Hanlun Guan;Danyu Mu;Yue Zhou;Hong Zhang;Hao Jin;Shurong Dong;Xiaoyi Wang;Feng Gao

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引用次数: 0

Abstract

Conventional wireless passive surface acoustic wave (SAW) strain sensors often employ rigid materials, limiting their application on curved surfaces. This letter presents a fully flexible wireless passive strain sensor, implemented by the flip-chip integration of an ultra-thin SAW device with a flexible antenna. The SAW sensor, fabricated on a 50-

$\mu $

m ST-cut quartz substrate with 200-nm aluminum electrodes, is coupled with a flexible antenna made by patterning copper electrodes on a polyimide substrate. Experimental evaluations include both wired and wireless tests, demonstrating the system’s sensitivity of 121.63 Hz/

$\mu \varepsilon $

within a dynamic range of

$5000~\mu \varepsilon $

and a wireless transmission range exceeding one meter. Besides, the system also exhibits excellent linearity and repeatability. The fully flexible sensor design enhances the system’s versatility, enabling deployment in challenging environments, such as confined or curved surfaces, particularly for structural health monitoring applications.

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来源期刊

IEEE Electron Device Letters 工程技术-工程：电子与电气

CiteScore

8.20

自引率

10.20%

发文量

551

审稿时长

1.4 months

期刊介绍： IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.