In₂O₃–ZnO Superlattice Transistors by Atomic Layer Deposition With High Field-Effect Mobility

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ziheng Wang;Jinxiu Zhao;Kai Jiang;Yuan Li;Zhenyu Chen;Chen Wang;Guangzheng Yi;Kunlin Cai;Zhiyu Lin;Liankai Zheng;Tianning Cui;Xiuyan Li;Xueli Ma;Guilei Wang;Chao Zhao;Arokia Nathan;Jun Yu;Mengwei Si
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引用次数: 0

Abstract

In this work, we demonstrate high-performance atomic-layer-deposited indium-zinc oxide (IZO) transistors by introducing In2O3-ZnO superlattice, achieving high field-effect mobility ( $\mu _{\text {FE}}\text {)}$ . The electrical properties, such as carrier density and mobility, can be further tuned by the thickness of In2O3 and ZnO layers beyond material composition. The crystallinity of In2O3-ZnO superlattice channel can also be improved by the design of In2O3 and ZnO multilayer. Therefore, an enhanced $\mu _{\text {FE}}$ is achieved together with high on/off ratio and steep subthreshold slope (SS). Besides, devices with channel length down to 80 nm are fabricated, with CF4 plasma treatment utilized to suppress carrier density, achieving high on-current, steep SS and enhancement-mode operation. The In2O3–ZnO superlattice enables a new approach to effectively engineer the material properties of oxide semiconductors for further performance enhancement beyond conventional material composition engineering.
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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