Optimization of CsPbCl3 violet/blue all-inorganic light-emitting diodes devices

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Weifang Zhang, Shenwei Wang, Lixin Yi
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引用次数: 0

Abstract

Large grain films can effectively reduce the density of defect states; however, the performance of electroluminescent (EL) devices prepared by directly annealing the light-emitting layer remains unsatisfactory. In this paper, we propose a novel preparation method aimed at solving the problem of low carrier recombination probability in films with large grains. In this experiment, an unannealed CsPbCl3 film was grown based on an annealed CsPbCl3 film. The experimental results indicate that, compared with the devices of single light-emitting film, the devices of double-layer film significantly improve the intensity and stability of EL. For the lower layer of CsPbCl3, it is essential to balance the thickness and annealing parameters. The findings reveal that device performance is optimal when the annealing temperature is set at 180 °C for a thickness of 150 nm, while the upper layer thickness is maintained at 120 nm. Additionally, stability is significantly enhanced, with the device lasting for 9 min before decaying to 48 % of its initial brightness. At the same time, the full width at half maximum is only 9.7 nm, showing high color purity. This improvement can be attributed to several factors: the epitaxial growth of the annealed layer enhances grain size and minimizes the number of grain boundaries, thereby suppressing ion migration. Additionally, films with larger grains demonstrate a lower density of defect states, which can mitigate non-radiative recombination processes. Finally, a higher valence band facilitates hole injection and aids in balancing carrier transport.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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