Simya Olavil-Karayi , Kursad Sezer , Giray Kartopu , Michael D.K. Jones , Prabeesh Punathil , Ochai Oklobia , John Tyrer , Lewis C.R. Jones , Yongtao Qu , Vincent Barrioz , Guillaume Zoppi , Neil S. Beattie , Elliot Woolley
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引用次数: 0
Abstract
Copper zinc tin sulfide (CZTS) thin films have the potential to be an absorber material in photovoltaic (PV) cells due to their optimal bandgap and high absorption coefficient. Despite their potential, issues such as low carrier mobility, short lifetime, and structural defects limit their application. Post-deposition annealing, which involves heating the films in a controlled atmosphere is usually required to improve film structure. Traditional annealing is a slow, energy-demanding process and incompatible with certain substrates, including temperature-sensitive polymeric materials and metallic foils. This work demonstrates a diode laser (808 nm) treatment as a rapid alternative to induce crystallization in CZTS films, potentially eliminating the need for traditional furnace annealing, thereby offering potential advantages in both time and energy consumption. The results show that diode laser treatment can promote crystallization of CZTS thin films, as confirmed by Raman studies. Photoluminescence (PL) spectroscopy revealed that the wider bandgap (∼1.78 eV) of the as-deposited material nanocrystalline material is reduced to around 1.4 eV upon laser annealing and the PL emission intensity showed significant enhancement, which are ascribed to improvement in both the crystal size and quality. Such improvements promise to have the potential to address some of the remaining challenges in using CZTS as an absorber material in next-generation PV cells.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.