High-Frequency Balun With Compact Size and Low Loss on Self-Packaged Air-Filled Suspended Line

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Xin Guo;Yang Tao;Wen Wu
{"title":"High-Frequency Balun With Compact Size and Low Loss on Self-Packaged Air-Filled Suspended Line","authors":"Xin Guo;Yang Tao;Wen Wu","doi":"10.1109/TCPMT.2024.3501401","DOIUrl":null,"url":null,"abstract":"In this article, a kind of miniaturized broadband balun is proposed and designed with high operating frequency and low insertion loss based on the low-cost self-packaged air-filled suspended line and its specialized extended filter theory. The filter theory is extended as follows. First, through making clear the out-of-phase outputs, impedance property of half-wavelength resonator, and miniaturized resonator topology, the three-port balun circuit could be synthesized with exact element values, according to the required in-band ripple and bandwidth. Second, the quantitative design of quasi-lumped component based on self-packaged air-filled suspended line is executed to obtain low-loss balun at high frequency within the compact size. Third, taking full advantage of features of circuit topology and physical structure, the direct feeding method and the strong coupling strength provided by these double-layer quasi-lumped components guarantee a wide operating band. For validation, one fourth-order balun operating at 10 GHz and one sixth-order balun operating at 6 GHz are fabricated and measured. The good performance validates the proposed design approach and low-loss compact self-packaged structure.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 2","pages":"356-366"},"PeriodicalIF":2.3000,"publicationDate":"2024-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10756712/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

In this article, a kind of miniaturized broadband balun is proposed and designed with high operating frequency and low insertion loss based on the low-cost self-packaged air-filled suspended line and its specialized extended filter theory. The filter theory is extended as follows. First, through making clear the out-of-phase outputs, impedance property of half-wavelength resonator, and miniaturized resonator topology, the three-port balun circuit could be synthesized with exact element values, according to the required in-band ripple and bandwidth. Second, the quantitative design of quasi-lumped component based on self-packaged air-filled suspended line is executed to obtain low-loss balun at high frequency within the compact size. Third, taking full advantage of features of circuit topology and physical structure, the direct feeding method and the strong coupling strength provided by these double-layer quasi-lumped components guarantee a wide operating band. For validation, one fourth-order balun operating at 10 GHz and one sixth-order balun operating at 6 GHz are fabricated and measured. The good performance validates the proposed design approach and low-loss compact self-packaged structure.
求助全文
约1分钟内获得全文 求助全文
来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信