Yuling Shang;Longlu Geng;Chunquan Li;Zhuofan Song;Jintao Zhang;Junji Li
{"title":"Research on Multifault Testing Method for MIV Based on Grid Search and Random Forest","authors":"Yuling Shang;Longlu Geng;Chunquan Li;Zhuofan Song;Jintao Zhang;Junji Li","doi":"10.1109/TCPMT.2025.3530519","DOIUrl":null,"url":null,"abstract":"With the fast development trend of highly integrated electronic products, as the key technology of 3-D interconnect circuits, the research on monolithic intertier via (MIV) testing technology is particularly critical. Due to the high integration density, the MIV itself is very prone to manufacturing faults, moreover, the uncertainty of fault location, the complexity of fault type, that will have a greater impact on the signal transmission performance of the MIV. Therefore, in order to effectively isolate the faults and reduce the loss of assembly yield, a new nondestructive MIV fault testing method is proposed. The method adopts random forest (RF) classification model optimized based on grid search (GS) optimization algorithm. This test method can effectively solve the problem that traditional MIV test methods are difficult to accurately test for MIV faults. As well as the study of multifault in response to the fact that the existing methods are less studied for the presence of multifault in MIV. The simulation results show that the GS-RF-based MIV fault testing method can avoid damage to the MIV under testing during the MIV fault testing process, and the accuracy of single-fault testing reaches 96.11%, and the accuracy of multifault testing reaches 91.38%.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 2","pages":"319-327"},"PeriodicalIF":2.3000,"publicationDate":"2025-01-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10843737/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
With the fast development trend of highly integrated electronic products, as the key technology of 3-D interconnect circuits, the research on monolithic intertier via (MIV) testing technology is particularly critical. Due to the high integration density, the MIV itself is very prone to manufacturing faults, moreover, the uncertainty of fault location, the complexity of fault type, that will have a greater impact on the signal transmission performance of the MIV. Therefore, in order to effectively isolate the faults and reduce the loss of assembly yield, a new nondestructive MIV fault testing method is proposed. The method adopts random forest (RF) classification model optimized based on grid search (GS) optimization algorithm. This test method can effectively solve the problem that traditional MIV test methods are difficult to accurately test for MIV faults. As well as the study of multifault in response to the fact that the existing methods are less studied for the presence of multifault in MIV. The simulation results show that the GS-RF-based MIV fault testing method can avoid damage to the MIV under testing during the MIV fault testing process, and the accuracy of single-fault testing reaches 96.11%, and the accuracy of multifault testing reaches 91.38%.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.