Increased high-temperature stiffness of an epoxy-based molding compound through high-temperature storage

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-02-08 DOI:10.1016/j.microrel.2025.115605

Masaya Ukita, Keisuke Wakamoto, Ken Nakahara

{"title":"Increased high-temperature stiffness of an epoxy-based molding compound through high-temperature storage","authors":"Masaya Ukita, Keisuke Wakamoto, Ken Nakahara","doi":"10.1016/j.microrel.2025.115605","DOIUrl":null,"url":null,"abstract":"<div><div>This paper investigates the tensile mechanical properties of epoxy-based molding compound (EMC) films containing 88 % silica filler. The EMC material was molded under 175 °C at 13.8 MPa pressure for 2 min and cured at 175 °C for 5 h to form 200 μm films. The films were cut into a dog-bone shape, whose stress–strain (S<img>S) curves were measured by quasi-static tensile test at a test temperature (Tte) of room temperature (RT), 100 °C, and 150 °C. As Tte increased, all the initial curves changed from brittle-like to ductile-like. Next, the films were subjected to storage at a temperature of 150 °C (Tst0) for 24, 168, and 500 h. With increasing storage time, the stiffness of the films at Tte = 150 °C increased, while their RT counterpart did not show significant changes. This Tte-dependent difference in mechanical property was likely caused by oxidation as revealed by Fourier transform infrared spectroscopy analysis, and consequently resulted in a difference in stress distribution between 150 °C and RT in an EMC-on-metal assembly, which was confirmed by finite element method stress simulation.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"166 ","pages":"Article 115605"},"PeriodicalIF":1.6000,"publicationDate":"2025-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425000186","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

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Abstract

This paper investigates the tensile mechanical properties of epoxy-based molding compound (EMC) films containing 88 % silica filler. The EMC material was molded under 175 °C at 13.8 MPa pressure for 2 min and cured at 175 °C for 5 h to form 200 μm films. The films were cut into a dog-bone shape, whose stress–strain (SS) curves were measured by quasi-static tensile test at a test temperature (T_te) of room temperature (RT), 100 °C, and 150 °C. As T_te increased, all the initial curves changed from brittle-like to ductile-like. Next, the films were subjected to storage at a temperature of 150 °C (T_st⁰) for 24, 168, and 500 h. With increasing storage time, the stiffness of the films at T_te = 150 °C increased, while their RT counterpart did not show significant changes. This T_te-dependent difference in mechanical property was likely caused by oxidation as revealed by Fourier transform infrared spectroscopy analysis, and consequently resulted in a difference in stress distribution between 150 °C and RT in an EMC-on-metal assembly, which was confirmed by finite element method stress simulation.

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.