High-performance solar-blind UV photodetector based on single p-type Cu-doped β-Ga2O3 microwire

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yan-Ming Wang , Xue Sui , Shuo Wang , Jia-Hui Shi , Yi-Han Yang , Qiu-Ju Feng , Chong Gao , Jing-Chang Sun
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引用次数: 0

Abstract

β-Ga2O3 is a ideal material for fabricating solar-blind UV photoelectric detectors.
However, since the intrinsic β-Ga2O3 shows n-type conductivity, achieving p-type has been challenging, thereby hindering the development of β-Ga2O3 optoelectronic devices. In this study, we fabricated a photoconductive ultraviolet photodetector based on single Cu-doped β-Ga2O3 microwire. Centimeter-scale β-Ga2O3 microwires with varying Cu doping contents were synthesized using chemical vapor deposition method. These microwires had a diameter of approximately 30 nm and a length of up to about 0.8 cm. The p-type conductivity of the Cu-doped β-Ga2O3 microwires was confirmed through thermoelectric effect testing. Futhermore, we found that the photodetector composed of microwire with Cu molar percentage of 3.4 % demonstrated the best UV detection performance. The single Cu-doped β-Ga2O3 microwire detector exhibited excellent solar-blind photodetector performance, characterized by a high responsivity (57.7 A/W under a bias of 10 V), and external quantum efficiency of 28215 % (under a bias of 10 V), and an Iphoto/Idark ratio of 2.66 × 104 @ 10 V, as well as good stability and repeatability. This work provide a simple and efficient method to preparing p-type β-Ga2O3 nano/microstructure and high-performance, stable β-Ga2O3-based photodetectors.

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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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