Giant spin Seebeck in semiconducting ferromagnetic Ga0.5V0.5As

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Timothy M. Ashani, Abdullah, Imran Khan, Jisang Hong
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引用次数: 0

Abstract

The spin Seebeck effect (SSE) represents one of the most essential features in the field of spin caloritronics. The generation of spin current in magnetic materials based on temperature gradient is referred to as the SSE. However, a low SSE in most magnetic materials poses a setback to potential device applications. Hence, a search for new magnetic materials with a giant SSE becomes fundamental and time sensitive. So, we investigate the directional spin-dependent transport features of bulk Ga0.5V0.5As ferromagnetic semiconductor using the Boltzmann transport method. The spin-dependent electronic thermal conductivity (k and k) and electrical conductivity (σ and σ) obtained were higher along the perpendicular channel. We found a giant effective SSE of magnitude 1469 μVK-1 along the perpendicular channel and 1440 μVK-1 along the in-plane channel in the n-type systems. These values are several times larger than in most other bulk systems. Overall, we obtained higher ZT values in the perpendicular channel. Our calculated spin and charge ZT values of 0.59 and 0.63 are about 50 times higher than the ZT of bulk non-magnetic, pristine GaAs. Thus, our findings may serve as baseline data for further experimental studies on energy applications in the field of spin caloritronics.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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