{"title":"Schottky-MIS Cascode Drain Reverse-Blocking p-GaN Gate Transistor With Significantly Reduced Forward Drop and Ultralow Leakage Current","authors":"Fangzhou Wang;Changhong Gao;Guojian Ding;Cheng Yu;Xiaoliang Wang;Zhuocheng Wang;Xiaohui Wang;Qi Feng;Ping Yu;Xinghuan Chen;Yang Wang;Wanjun Chen;Haiqiang Jia;Hong Chen;Bo Zhang;Zeheng Wang","doi":"10.1109/LED.2024.3515211","DOIUrl":null,"url":null,"abstract":"In this article, we experimentally propose a reverse-blocking (RB) p-GaN gate transistor with the Schottky-MIS cascode drain (CDT) for the significantly reduced forward voltage drop <inline-formula> <tex-math>${\\textit {V}}_{\\mathbf {F}}$ </tex-math></inline-formula> and ultralow reverse leakage current <inline-formula> <tex-math>${I}_{\\mathbf {\\textit {LEAK}}}$ </tex-math></inline-formula>. At forward bias, electron concentration at the Schottky-MIS cascode drain is higher than that at conventional p-GaN/Ohmic drain. When experiencing reverse bias, the Schottky-MIS cascode drain effectively protects the Schottky contact from the high reverse potential compared to Schottky drain. The fabricated Schottky-MIS CDT presents a superior <inline-formula> <tex-math>${V}_{\\mathbf {F}}$ </tex-math></inline-formula> - <inline-formula> <tex-math>${I}_{\\mathbf {\\textit {LEAK}}}$ </tex-math></inline-formula> relationship including a greatly reduced <inline-formula> <tex-math>${V}_{\\mathbf {F}}$ </tex-math></inline-formula> of 3.1V as well as an ultralow <inline-formula> <tex-math>${I}_{\\mathbf {\\textit {LEAK}}}$ </tex-math></inline-formula> of <inline-formula> <tex-math>${1}\\times {10} ^{-{8}}$ </tex-math></inline-formula> A/mm, together with a competitive reverse power figure-of-merit (FOM) of 120MW/cm2. These performances suggest that the proposed Schottky-MIS CDT can be a promising candidate for low-loss RB GaN power transistors and applications requiring a better <inline-formula> <tex-math>${V}_{\\mathbf {F}}$ </tex-math></inline-formula> - <inline-formula> <tex-math>${I} _{\\mathbf {\\textit {LEAK}}}$ </tex-math></inline-formula> trade-off.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"46 2","pages":"131-134"},"PeriodicalIF":4.1000,"publicationDate":"2024-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10794516/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this article, we experimentally propose a reverse-blocking (RB) p-GaN gate transistor with the Schottky-MIS cascode drain (CDT) for the significantly reduced forward voltage drop ${\textit {V}}_{\mathbf {F}}$ and ultralow reverse leakage current ${I}_{\mathbf {\textit {LEAK}}}$ . At forward bias, electron concentration at the Schottky-MIS cascode drain is higher than that at conventional p-GaN/Ohmic drain. When experiencing reverse bias, the Schottky-MIS cascode drain effectively protects the Schottky contact from the high reverse potential compared to Schottky drain. The fabricated Schottky-MIS CDT presents a superior ${V}_{\mathbf {F}}$ - ${I}_{\mathbf {\textit {LEAK}}}$ relationship including a greatly reduced ${V}_{\mathbf {F}}$ of 3.1V as well as an ultralow ${I}_{\mathbf {\textit {LEAK}}}$ of ${1}\times {10} ^{-{8}}$ A/mm, together with a competitive reverse power figure-of-merit (FOM) of 120MW/cm2. These performances suggest that the proposed Schottky-MIS CDT can be a promising candidate for low-loss RB GaN power transistors and applications requiring a better ${V}_{\mathbf {F}}$ - ${I} _{\mathbf {\textit {LEAK}}}$ trade-off.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.