{"title":"Thermomechanical free vibration buckling of FG graphene-reinforced doubly-curved sandwich shells","authors":"Mustafa Eroğlu , Mehmet Akif Koç , İsmail Esen","doi":"10.1016/j.advengsoft.2025.103875","DOIUrl":null,"url":null,"abstract":"<div><div>This study explores the thermomechanical free vibration and buckling behavior of doubly-curved sandwich shell structures with a core of FG graphene-reinforced foam and metal or ceramic face layers. Using Hamilton's principle and a Navier-type solution method, the governing equations and boundary conditions for simply supported, functionally graded doubly-curved shells are derived. The numerical results are validated through comparison with existing literature. The analysis focuses on the effects of the material grading index, foam void ratio, graphene volume fraction, side-to-thickness ratio, and temperature variations. Notably, it was observed that as <em>R<sub>1</sub></em> increases from α to 10α, the buckling temperature significantly decreases, highlighting a reduction in thermal stability with increasing radii or inverse correlation between <em>R<sub>1</sub></em> and <em>R<sub>2</sub></em>. These findings reveal unexpected thermal instability trends that could influence future design considerations for high-temperature applications. This study provides novel insights into the thermomechanical behavior of advanced sandwich structures, offering valuable contributions to the field in light of evolving technological needs.</div></div>","PeriodicalId":50866,"journal":{"name":"Advances in Engineering Software","volume":"202 ","pages":"Article 103875"},"PeriodicalIF":4.0000,"publicationDate":"2025-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advances in Engineering Software","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0965997825000134","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS","Score":null,"Total":0}
引用次数: 0
Abstract
This study explores the thermomechanical free vibration and buckling behavior of doubly-curved sandwich shell structures with a core of FG graphene-reinforced foam and metal or ceramic face layers. Using Hamilton's principle and a Navier-type solution method, the governing equations and boundary conditions for simply supported, functionally graded doubly-curved shells are derived. The numerical results are validated through comparison with existing literature. The analysis focuses on the effects of the material grading index, foam void ratio, graphene volume fraction, side-to-thickness ratio, and temperature variations. Notably, it was observed that as R1 increases from α to 10α, the buckling temperature significantly decreases, highlighting a reduction in thermal stability with increasing radii or inverse correlation between R1 and R2. These findings reveal unexpected thermal instability trends that could influence future design considerations for high-temperature applications. This study provides novel insights into the thermomechanical behavior of advanced sandwich structures, offering valuable contributions to the field in light of evolving technological needs.
期刊介绍:
The objective of this journal is to communicate recent and projected advances in computer-based engineering techniques. The fields covered include mechanical, aerospace, civil and environmental engineering, with an emphasis on research and development leading to practical problem-solving.
The scope of the journal includes:
• Innovative computational strategies and numerical algorithms for large-scale engineering problems
• Analysis and simulation techniques and systems
• Model and mesh generation
• Control of the accuracy, stability and efficiency of computational process
• Exploitation of new computing environments (eg distributed hetergeneous and collaborative computing)
• Advanced visualization techniques, virtual environments and prototyping
• Applications of AI, knowledge-based systems, computational intelligence, including fuzzy logic, neural networks and evolutionary computations
• Application of object-oriented technology to engineering problems
• Intelligent human computer interfaces
• Design automation, multidisciplinary design and optimization
• CAD, CAE and integrated process and product development systems
• Quality and reliability.